High temperature behavior of Ni₃Al under compressive stress: creep and diffusion bonding

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Lee, Chen-Sheng

Date Published: 1991

Subjects: Nickel-aluminum alloys--Creep
Nickel-aluminum alloys--Fatigue

Program of Study: Metallurgy, Mechanics, and Materials Science

Degree Level: Doctoral

Language: English

Pages: xii, 182 pages

Permalink: https://doi.org/doi:10.25335/bgcs-vq21

Full text