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DATE DUE MTE DUE DATE DUE use wmmn A STUDY OF CONDUCTIVITY IN A COMPLEX GEOMETRY By Sangil Hyun A DISSERTATION Submitted to Michigan State University In partial fulfillment of the requirements For the degree of DOCTOR OF PHILOSOPHY Department of Physics and Astronomy 1998 ABSTRACT A STUDY OF CONDUCTIVITY IN A COMPLEX GEOMETRY By Sangil Hyun I present a study of the conductivity1 of a material with a complex geometry. There are three main parts in this dissertation, the determination of the isotropic conductivity, anisotropic conductivity, and effective conductivity. In the first part, a method using a multi-probe measurement together with a numerical simulation is introduced for the determination of the isotropic conductivity in a complex geometry. This method has been demonstrated on micron-sized diamond crystallites and diamond homoepitaxial films. The 3d-computer image for the finite element method (FEM) has been reconstructed from the scanning electron microscope (SEM) photos. For a sample with four probes, a 6 x 6 geometrical factor matrix is generated from the FEM analysis. In addition, the experimental measurement on the sample provides another 6 x 6 resistance matrix. The sample conductivity and contact resistances can be determined by the least- square fitting for the geometrical factors and the resistances. In the second part, this method is generalized for the anisotropic conductivity that is represented by a 3 x 3 tensor. It has been validated on computer models and real material (bismuth). This modified numerical scheme using the FEM analysis and the iterative linearization technique has identified the anisotropic conductivity tensor within acceptable errors in most cases. Some conditions for the application of this technique have been suggested from the analysis of the results. In the last part, I describe the effective conductivity of a composite material. Much research has been done to investigate the electric, thermal, and elastic properties of composite materials. However, only a few problems with a simple geometry have been solved analytically. For instance, the dielectric properties of a composite that includes two perfect circular conductors have been determined analytically by a multipole expansion method. However, for complex composites, the analytic solutions cannot be obtained in most cases. Therefore, a numerical technique using the finite element method has been introduced for problems where the analytic approach fails. The FEM analysis is known as the most effective scheme to solve a boundary value problem in a complicated geometry. The simulation using this method is a primary step to understanding the effective medium theory for a complex composite material. To demonstrate this technique in the study of composite materials, numerical simulations have been performed and the results have been compared with the analytical solutions for a simple composite material. To all whom I am indebted for this, especially North Koreans in the horrible famine. ACKNOWLEDGMENTS I would like to thank Professor M. F. Thorpe for his considerate and patient guidance over the years. His insights into physics and passions on the study have made a deep impression on me. Also, I like to appreciate Professors S. D. Mahanti, N. O. Birge, D. Stump, and S. Hawley for being my guidance committee members. The collaboration with Professor B. Golding, Professor A. R. Day, and Dr. M. D. Jaeger has been a great pleasure and experience to me. I want to acknowledge Ms. J. King for her help. I appreciate many people who have shared their lives in this small building, especially, H. Seong, K. Chun, J. S. Moon, B. Djordjevic, and J. U. Kim. They have made my life here always delightful. I appreciate also L. Malete for his helping on my manuscript. I know there have been invaluable and uncountable help from many people who have not been named here. They should be acknowledged, too. My study would not be accomplished without the prayer, support, and patience of my dear parents, M. G. Hyun and G. J. Kim, and whole family including a newly born nephew, SeongWon, whom I have not yet meet. My deep thanks should go to them. I want to represent a special gratitude to my beloved Myeoung H. Oh who has shared the valuable and memorable times with me. I thank you more than I can express. Finally, my thanks would go to Him who have created the world and me. In my whole life, He has lead me to the truth with His boundless love. TABLE OF CONTENTS LIST OF TABLES ................................................................................ viii LIST OF FIGURES ................................................................................ X CHAPTER 1 INTRODUCTION 1 CHAPTER 2 CONDUCTIVITY MEASUREMENT OF MICRON-SIZED DIAMOND CRYSTALLITES 4 2.1 INTRODUCTION .................................................................................................................. 4 2.1.1 motivation ............................................................................................................... 4 2.1.2 van der Pauw formula for 2d film .......................................................................... 8 2.1.3 inverse problem .................................................................................................... 1 1 2.1.4 Finite Element Method (FEM) ............................................................................. 15 2.2 THEORY ........................................................................................................................... 23 2.2.1 conductivity and geometrical factors ................................................................... 23 2.2.2 resistance table and its properties ....................................................................... 25 2.2.3 contact resistances ............................................................................................... 31 2.3 COMPUTER SIMULATION .................................................................................................. 34 2.3.1 reconstruction of 3d computer image ................................................................... 34 2.3.2 modeling and analysis using FEM ....................................................................... 39 2.3.3 least square fitting ................................................................................................ 47 2.4 EXPERIMENT .................................................................................................................... 50 2.4.1 sample preparation ............................................................................................... 50 2.4.2 four-probe measurement ...................................................................................... 53 2.5 ANALYSIS ......................................................................................................................... 55 2.5.1 diamond film ......................................................................................................... 55 2.5.2 sample I (Ohmic contacts) ................................................................................... 60 2.5.3 sample 2 (non-Ohmic contacts) ............................................................................ 62 2.6 CONCLUSION .................................................................................................................... 68 CHAPTER 3 ANISOTROPIC CONDUCTIVITY MEASUREMENT FOR COMPLEX GEOMETRY 70 3.] INTRODUCTION ............................................................................................................... 70 3.2 THEORY .......................................................................................................................... 72 3.2.1 anisotropic conductivity tensor ............................................................................ 72 3.2.2 iterative linearization technique for nonlinear inverse problem ......................... 74 3.2.3 orthogonal transformation ................................................................................... 80 3.3 COMPUTER SIMULATION ................................................................................................ 81 3.3.1 sample geometry ................................................................................................... 81 3.3.2 simulated experimental data using FEM ............................................................. 83 3.3.3 iterative linearization fitting using FEM ............................................................. 84 3.4 EXPERIMENT .................................................................................................................. 85 3.4.1 sample preparation (Bi cylinder) ......................................................................... 85 3.4.2 six-probe measurement ......................................................................................... 88 3.5 ANALYSIS ....................................................................................................................... 89 3.5.1 computer generated sample (2d) .......................................................................... 89 vi 3.5.2 computer generated sample (3d) ................................................................................ 92 3.5.3 real sample (Bi cylinder) ............................................................................................ 96 3.5.4 stability test ............................................................................................................... 101 3.6 CONCLUSION ....................................................................................................................... 106 CHAPTER 4 EFFECTIVE CONDUCTIVITY OF A MEDIUM WITH CIRCULAR INCLUSIONS 108 4.1 INTRODUCIION ............................................................................................................. 108 4.2 A BRIEF HISTORY OF THE STUDY ON A COMPOSITE MATERIAL .................................... 109 4.3 THEORY ........................................................................................................................ 1 13 4.3.1 4-point resistance (R4) ........................................................................................ 114 4.3.2 Z-point resistance (R2) ........................................................................................ 118 4.3.3 The ratio of R4 and R2 ..................................................................................... 121 4.4 COMPUTER SIMULATION .............................................................................................. 122 4.4.] FEM analysis for 2d composite .......................................................................... 122 4.4.2 FEM analysis for 3d composite .......................................................................... 124 4.5 ANALYSIS ..................................................................................................................... 126 4.5.1 2d composite ....................................................................................................... 126 4.5.2 3d composite ....................................................................................................... 128 4.5.3 The ratio of 4-point and 2-point resistances ...................................................... 130 4.6 CONCLUSION ................................................................................................................ 130 APPENDICES 133 A.I RECIPROCITY THEOREM .............................................................................................. I34 A.2 COUNTING OF INDEPENDENT 4-TERMINAL TERMS ....................................................... 138 A.3 RESISTANCES OF TWO PERFECT HYPERSPHERICAL CONDUCTORS ............................. I40 REFERENCES 145 vii Table 2.1 Table 2.2 Table 2.3 Table 2.4 Table 2.5 Table 2.6 Table 2.7 Table 2.8 Table 2.9 Table 2.10 Table 2.11 Table 2.12 Table 2.13 Table 2.14 Table 2.15 Table 2.16 Table 2.17 Table 2.18 Table 2.19 Table 2.20 Table 2.21 LIST OF TABLES Selected properties of diamond structure semiconductors 4 A resistance table from all possible combinations of voltage and current measurements 27 How to generate the triangular matrix from six diagonal terms so that the triangular matrix produces a whole table 30 The number of independent elements in the resistance table 30 Resistance table with two contact resistances for current flows 32 The characteristics of the meshings for each sample 42 The Ohmic resistance table obtained from Table 2.5 (symmetric) 48 The non-Ohmic resistance table obtained from Table 2.5 (non-symmetric) ----- 48 The characteristics of CVD diamond samples 52 Resistances measured for homoepitaxial film by 4—probe experiment (k9) ----- 56 Geometrical factor table obtained by FEM (mm") 56 The resistivity and contact resistances of diamond film (Film 1) given by van der Pauw formula (VDP) and our method. 56 Resistances measured by 4—probe experiment (1(9) 58 Another resistance table for the opposite current flows of Table 13 (k9)-------- 58 Geometrical factors calculated from FEM (mm") 58 The resistivity and contact resistances of Film 2 given by van der Pauw formula (VDP) and our method. 58 Stability test of 4—terminal resistances on the position of one contact -- -------- 59 Resistances obtained from the experimental measurement for Sample 1 (kfl)-—— 61 Geometrical factors from the finite element method for Sample 1 (um")-------- 61 Resistivity and contact resistances for Sample 1, assuming that all the contact resistances were Ohmic. 61 Resistances obtained from the experimental measurement for Sample 2 (kQ)--- 64 viii Table 2.22 Geometrical factors from the finite element method for Sample 2 (um’l )------ 64 Table 2.23 Resistivity and contact resistances for Sample 2 64 Table 2.24 Fit result of conductivity model with two activation energies for data in Figure 2.27 66 Table 3.1 Electrical resistivity of metalic crystals. Values of principal resistivities at T=20° C. (in unit 1045 (2 cm) 71 Table 3.2 The comparison of the fitted results of the conductivity tensor elements with the prescribed values for the computer model in 2d 91 Table 3.3 The comparison of the fitted results of the conductivity tensor elements with the prescribed values for the computer model in 3d 93 Table 3.4 Principal values of the resistivity of Bi. (104’ 9 cm) 99 Table 3.5 Different meshings for the stability test of a cylindrical sample 102 Table 3.6 Different meshings for the stability test of Cylinder2 106 Table A.l The number of independent 4-terminal terms in a resistance matrix for n-probe measurement 1 39 ix Figure 2.1 Figure 2.2 Figure 2.3 Figure 2.4 Figure 2.5 Figure 2.6 Figure 2.7 Figure 2.8 Figure 2.9 Figure 2.10 Figure 2.11 HngH Figure 2.13 Figure 2.14 Figure 2.15 Figure 2.16 LIST OF FIGURES A polycrystalline diamond film (a) and a bicrystal (b) that was formed by two single crystallites 5 A typical shape of CVD diamonds used in this measurement. It is a micron-sized sample grown on a Si substrate. 6 The conductivity measurement of a simple shaped sample is usually straightforward. This cylindrical geometry forms constant electric current pattern inside the sample 7 The conductivity measurement of 2D film in arbitrary geometry is done by four- probe measurement. 9 A clover-shaped film (a) and a bridge-shaped film (b) are used for four-probe measurement. 10 A schematic of the inverse and direct problem. Those two problems can be characterized by what is known and what is determined in the problem.----- 12 Heat conduction problem on a simple bar 13 A boundary value problem is solved in this irregular geometry. Boundary conditions on each surface are needed. 16 Some typical element shapes are presented for FEM. Each element has nodes on the vertices or some extra nodes on the edges to enhance the accuracy. 17 Highly distorted meshes that are not usually acceptable in mesh generating ---- 18 A sample of meshed geometry with square-shaped elements in 2d ----------- 19 By the FEM analysis, a voltage distribution on a sample is obtained. The interpolation technique is used to obtain the distribution inside the elements.--- 22 For 2-terminal measurement, the voltage is calculated by a line integral along the path I and the current is obtained by a surface integral on the cross section S.-- 23 Showing a conductor that has four probes that are attached on the surface mm 24 Micron-sized diamond crystal grown by a chemical vapor deposition technique before Au leads were attached. Five titanium contacts were formed on the surface and four of them (indexed) were used for the measurement. --- 26 Contact resistances have two different values (I; , r, ') for non-Ohmic contacts. A resistance measurement consists of a sample resistance Rm“, and contact resistances added in series. 32 Figure 2.17 Figure 2.18 Figure 2.19 Figure 2.20 Figure 2.21 Figure 2.22 Figure 2.23 Figure 2.24 Figure 2.25 Figure 2.26 Figure 2.27 Figure 3.1 Each SEM photo is given in an orientation for viewing angle (9, 4)) as shown in this figure. 34 SEM photos of a sample (Sample 2) in various orientations. (a) 9, ¢ = 0° , 0° (b) 6, ¢ = 50° , 0° (c) 9, ¢ = 50° , 90° ((1) 6, ¢ = 50° , 270° 35 Computer images reconstructed from SEM photos by image processing. Five small pyramids on the surface denote five contacts. Compare these two images with the SEM photos in the Figure 2.18. 38 Triangular planes generated from three keypoints were combined into a large plane as shown in (a). A volume could be constructed by connecting these large planes into a volume unit. The volume elements for the diamond crystallites were presented in (b) and (c). 40 The elements used for the meshing of 2d film (square) and 3d crystallites (tetrahedra). Sometimes elements that have only four nodes on the comers were used. 42 Meshed structures of the diamond film(a) and crystallites (Sample 1(b), Sample 2 (c)). Figure 2.20(b) and (c). Each model has square-shaped contacts on the surface. 43 Equipotential lines on the surface of the samples given by ABAQUS. (a) is for homoepitaxial film. (b), (c) are for Sample 1. (d),(e) are for Sample 2. The figures of 3d samples were obtained in different orientations. 46 A normal picture of the 2d sample (diamond homoepitaxial film) is shown in (a). Two schematics ((b), (c)) of the sample denote the positions of the contacts. Film 1 (b) has four contacts and film 2 (c) has six contacts. Gray-colored squares in the figures represent the contacts actually used for the measurement. 51 Two micron-sized CV D diamond crystallites, Sample 1 (a) and Sample 2 (b). Sample 1 has Au leads attached on the Ti contacts and Sample 2 is a shape before the lead attachment 51 Temperature dependence of a resistance of diamond crystallites (Sample 1 (solid circles) and Sample 2 (open circles)). To investigate the temperature dependence of the resistivity of these samples, a four-terminal resistance (R5) were measured over a wide range of temperatures. 54 Temperature dependence of the resistivities of the diamond samples. Two microcrystallites (MC-A, MC-B) correspond to Sample 1 and Sample 2. PF 1 and PF2 are polycrystalline films. HF 1 and HF2 are homoepitaxial films. The resistivity of these samples was obtained by rescaling the resistance measurement in Figure 2.26 using the fitted resistivity. 67 A diamond crystallite has a local defect (twin boundary) denoted by an arrow. This defect was neglected in the isotropic conductivity determination. 70 xi Figure 3.2 Figure 3.3 Figure 3.4 Figure 3.5 Figure 3.6 Figure 3.7 Figure 3.8 Figure 3.9 Figure 3.10 Figure 3.11 Figure 3.12 Figure 3.13 Iterative linearization technique of 12 minimization in 1d (Newton method). This technique is useful when the function form of the 12 is not known. Each step, the function form is approximated to a linearized form by Taylor expansion. After many iterations, it reaches the minimum point. 76 Many probes are attached on the surface of samples in 2d (a) and 3d (b). More contacts are needed for anisotropic conductivity tensor compared to isotropic conductivity tensor. 82 Schematics of a real sample (Bi cylinder) with six circular Au electrodes. (a) It is a relatively thin cylinder. Three contact pads were formed on each circular plane of the sample. (b) Three pads on a plane were formed to have an angle from three pads on the other plane. 86 The normal photos of the Bi sample for the real measurement.2 It has six contacts that are formed on both sides of the circular planes. (a) and (b) show the formation of contacts on these two sides. The ruler shows the size of the sample. 87 A computer generated sample for the determination of anisotropic conductivity. This 2d computer model has six circular probes. The contour map (b) shows the equipotential lines. The meshing was done by ANSYS and the analysis was done by ABAQUS. 89 These figures show the fitting procedures of the tensor in 2d. The fittings were performed using only 4-point resistances (a) or whole resistances in the table (b). Three data points are equivalent to three conductivity tensor terms.--—------ 90 Two principal directions were drawn on the surface of 2d computer model. Three directions (one real and two fitted) represent a remarkable coincidence.—- 91 The meshing (a) and equipotential lines (b) of a 3d computer generated sample. Six brick-shaped probes were formed on six facets of the sample. 94 These figures show the fitting procedures of the tensor in 3d. The fittings were performed using only 4-point resistances (a) or whole resistances in the table (b). Six parameters in a tensor were obtained each step. The iterations in 3d needed a few more steps to the optimum than in 2d. 95 Sensitivity test of the conductivities fitted by 4-point terms and whole table has been done to check the relation between the result and the Gaussian noise.---- 97 Equipotential lines of the real sample (Bi) obtained by FEM analysis. -------- -- 98 Fitting procedures of a resistivity tensor of the real sample. Two meshings were used to test our method on this sample. Only three principal components of the tensor were shown in these pictures. Two planar resistivity components (solid circle and square) are observed stable around the real value, but the perpendicular component (triangle) shows a substantial variation, especially in (b). —-—----- 100 xii Figure 3.14 Figure 3.15 Figure 3.16 Figure 3.17 Figure 3.18 Figure 4.1 Figure 4.2 Figure 4.3 Figure 4.4 Figure 4.5 Figure 4.6 Resistivity fittings were done for the Bi sample using three different meshings. BilO—l is a fine meshing and Bi4-2 is a rough meshing. It turned out that the perpendicular resistivity component was so sensitive on the meshing while the other components were stable. 103 Resistivity fittings were performed on some modified structures. The modifications were done by rotating the contact pads. The dependence of the result on the angles was shown in the figure. Huge variations were observed for all components. Interestingly, two planar resistivity components ( p,r , py) crossed over somewhere between 2° and 5° . 103 Equipotential lines of thicker cylindrical sample (Cylinder 2). This model has more layers of elements along the perpendicular direction. That may enhance the fitting result for that direction. 104 This graph was obtained from another computer test for the same geometry of the Bi cylinder (Cylinder l). The simulated resistances were generated by the meshing Bi10-l. The fitted results from different meshings were presented. The perpendicular component (triangle) shows still a huge variation for this computer model. 105 Another computer test for a thick sample (Cylinder 2) as shown in Figure 3.16. The simulated resistances were generated by the meshing BulklO—l. The fitting from other meshings could reproduce the all resistivity components nicely including the perpendicular component. 105 A composite material consists of two different dielectric constant regions (t:0 , 8,.) in dilute limit. 110 Elastic energy distribution in a composite material with many circular inclusions under hydrostatic pressure. The contour map was given by the elasticity analysis using ABAQUS. Elastic energy turned out to be distributed mostly near the necks between two circles. 112 4-point resistance measurement of two circular inclusions. The voltage between two inclusions is calculated in terms of the geometrical parameters when a constant electric field is applied. 115 Normalized current 10 is defined by the total current flowing through the cross section of the inclusions. 116 One dimensional composite material with two perfect conductor inclusions.--- 117 2-point resistance measurement of two circular inclusions. A resistance is obtained when the current flows between these two inclusions. 119 xiii Figure 4.7 Figure 4.8 Figure 4.9 Figure 4.10 Figure 4.11 Figure 4.12 Figure 4.13 Figure 4.14 Figure A.1 Figure A2 The geometry of 2d composite material with circular inclusions. Huge plates were attached to the host to form a constant electric field in 4-point resistance measurement. Those plates were removed for 2-point resistance measurement - 123 Contour graphs of voltage distribution near the neck in 2d. (a) is given from 4- point measurement and (b) is given from 2-point measurement. 123 Three—dimensional composite material with two spherical inclusions. Similar large bricks were attached to the host for 4-point measurement 125 Contour graph of voltage distribution near the neck in 3d. (a) is given from 4-point measurement and (b) is given from 2-point measurement 125 The meshed structure of the spherical inclusions. For a rough meshing, as these spheres approach together, the shape of the neck is getting less realistic because of the sharp ends of the spheres 126 Numerical solutions of the 4-point and 2-point resistances were obtained for 2d composite using FEM analysis. They agree well in all regions with the analytical solutions. (b) shows the detail in the close neck limit 127 Numerical solutions of the 4-point and 2-point resistances were obtained for 3d composite using FEM analysis. They agree nicely in most regions with the analytical solutions, but show some disagreements in an asymptotic regime (close limit). (b) shows the detail in that limit 129 The ratio between 4-point resistance and 2-point resistance in 2d and 3d. Each ratio was observed to approach a constant in the close neck limit ( w/ a << 1 ). The limiting value is given by Itin 2d and n2 / 3 in 3d 131 A sample with four probes and its equivalent circuit. The electric circuit is composed of many resistors that are fully connected 135 Two circular perfect conductors in a host material in the close neck limit ---—--- 141 xiv Chapter 1 INTRODUCTION The determination of the physical properties of a material has been one of the main topics in experimental and theoretical research over the years. It has been a primary step to characterize a specific material in most experiments. Moreover, the study has been considered as an important approach to investigate the structural dependence of material properties for some structured materials such as glasses, amorphous solids, and composites. The effective material properties have been considered for a composite that consists of more than one material. Some studies have been conducted to find an optimum structure associated with these physical properties (electric, mechanical, and thermal). The determination of these properties is usually straightforward in a simple geometry. However, it is not possible for complex structures such as an arbitrary-shaped diamond crystallite. The trouble in the determination usually comes from the complicated geometry of the material. This is one of main motivations of this study. The finite element method (FEM) has been adapted to deal with this trouble numerically. This technique is a powerful tool to solve a boundary value problem especially in a complex geometry. Sometimes, another computer simulation technique could be used to enhance the performance of this method. This numerical technique in the determination of the material properties provides a way to overcome a major limitation that results from complex geometry. In this dissertation, I describe the numerical determination of material properties. Throughout my work, only the electric properties (conductivity, resistance) have been considered. However, the methods suggested in this study can be applied to the determination of other material properties (thermal, elastic, etc.), too. In Chapter 2, I present the numerical method for the determination of the conductivity of micron-sized diamond crystallites. For this diamond sample, the conductivity is isotropic due to its symmetric lattice structure. The method is demonstrated on a diamond film for the comparison with the well-known van der Pauw method. Two main procedures, the multi- probe measurement and the FEM analysis are required to identify the sample conductivity. This work could be considered as the first measurement of a diamond crystallite in micron scale. In addition to conductivity, contact resistances are determined also quantitatively. The conductivity measurement of a single diamond crystal provides a primary step to the study of the transport properties in polycrystalline films. In Chapter 3, I introduce a more generalized technique for the evaluation of anisotropic conductivity that involves the 3 x 3 tensor. Aided by another computer simulation (iterative linearization technique), the method using FEM analysis determines the anisotropic tensor in a complex geometry. This generalized technique has been tested for computer models and for a real material (bismuth). The conditions for the application of this technique are obtained from the analysis of the result. In Chapter 4, this numerical technique (FEM) is introduced to study the electrical properties of a composite. A simple composite in 2d, which consists of a host and two circular inclusions has been selected for the demonstration of the method because some analytic solutions of the electric conduction problem are available in this geometry. Two resistances (4-point and 2-point) in the composite are defined and obtained numerically and analytically over a wide range of the neck distances between the inclusions. The numerical method turns out to reproduce remarkably well the analytic solutions. In addition, a simple relation between the resistances has been observed in the close neck limit. This relation may be useful in the study of the effective conductivity of a composite in random close packing. The numerical simulation using FEM could be considered a primary step in the study of the effective medium theory for a composite material, especially in a complex geometry. Chapter 2 CONDUCTIVITY MEASUREMENT OF MICRON-SIZED DIAMOND CRYSTALLITES 2.1 Introduction 2.1.1 motivation Because of its unique electrical and mechanical properties, diamond attracts much interest these days. It has very wide band gap, high thermal conductivity, and extreme strength as in Table 2.1. Motivated from these concerns, much research has been done on the determination of the electrical properties of this material. Although it behaves similarly in many respects to Si and Ge located in the same column of the periodic table, it has some unique properties compared to these semiconductor materials. However, most studies have been conducted on two-dimensional films because they can be fabricated easily and many important devices are in this form. A diamond film grown on a Si substrate (polycrystalline film) is a mixture of many isolated single crystallites (see Figure 2.1(a)), it includes many local defects (grain boundaries, twins, and dislocations) Table 2.1 Selected properties of diamond structure semiconductors. Band Ga Lattice Parameter Bond Energy Thermal Conductivity at 300K at 300K3 _1 4 at 300K (CV) (A) (kJ-mol ) (W-cm'l-C'l) Diamond 5.47 3.56683 347 24 ~ 255 Si 1.12 5.43095 196 1.53 Ge 0.66 5.64613 163 0.63 that contribute on the transport property of this film. One of these defects in the film is in the form of a bicrystal in Figure 2.1(b). The electric transport in a Si polycrystalline film has been investigated and modeled by the Trap Transistor Model.6'7 It turns out that the transport in a polycrystalline film is dominated by grain boundaries. The role of these local defects on transport in the diamond film has not been studied rigorously before, because some electric properties of a single crystal are not measured simply due to the complex geometry. Figure 2.2 shows an electron micrograph of typical single crystal that is a well faceted micron-sized diamond. Usually the determination of the conductivity of a regularly shaped macroscopic sample is straightforward, both in principle and in practice. For a suitable choice of the sample geometry, there is a region where the current flow is uniform and, if the voltage is sampled across this region the measurements are independent of the contact resistances [a so-called 4-terminal measurement] and the resistivity is easily obtained. An example of this is a cylinder in Figure 2.3 with current contacts near both ends and voltage probes (a) (b) Figure 2.1 A polycrystalline diamond film (a) and a bicrystal (b) that was formed by two single crystallites. near the center of the bar. Since this cylindrical conductor has constant area through the current direction, we have a simple relation for resistance R from the geometrical parameters (L, A) by L R: _ . pA, (21) where L is length and A is area. If I neglect the contact resistances coming from the 2- terrninal measurement, I need to use two extra contacts. The voltage between these two leads is free of a voltage drop across the electrical contacts. However, this approach is not possible for many samples for which regular shapes are difficult to obtain or fabricate, especially in the micron scale. There is a well-known 4-probe method to determine the conductivity in complex geometry, as first suggested by van der Pauw.8 However, this method requires some restrictions on the geometry of the sample and contact pads. The sample should be a quasi two-dimensional sample. The contacts should be on the circumference of the sample. Therefore, the van der Pauw method cannot be used for the 3d diamond crystallites. g); ZSKU 102.809 IP11 11019 Figure 2.2 A typical shape of CVD diamonds used in this measurement. It is a micron— sized sample grown on a Si substrate. Figure 2.3 The conductivity measurement of a simple shaped sample is usually straightforward. This cylindrical geometry forms constant electric current pattern inside the sample. I suggest a technique based on the multi-probe measurement of I-V characteristics and computer simulation using the finite element method (FEM). This method can be applied to an arbitrary sample geometry under a restriction that the sample is Ohmic. However, the contacts can be non-Ohmic. The diamond samples in this study have been grown by a chemical vapor deposition (CVD) technique on a silicon substrate with boron doping. This technique has been tested on a diamond film, and the conductivity of diamond crystallites has been determined. The conductivity of 3d microcrystallites has been measured and compared with that of a 2d film (especially polycrystalline film). Throughout this chapter, the conductivity of diamond is taken to be isotropic because of its lattice symmetry. Although the determination by this technique has been done on electrically isotropic diamond crystallites, it is a quite general scheme that can be applied to other materials. In Section 2.1.2, the van der Pauw method is briefly reviewed and compared with our technique. The general idea of the inverse problem and the finite element method (FEM) will be described in Section 2.1.3 and Section 2.1.4. In the following Section 2.2, I will introduce the resistance table from multi-probe measurements (Section 2.2.2) and the geometrical factor will be defined in Section 2.2.1 and the way to consider the contact resistances will be described in Section 2.2.3. Section 2.3 is devoted to computer simulations of image processing (Section 2.3.1), mesh generating and analysis using FEM (Section 2.3.2) and the x2 fitting technique to extract the material properties will be described in Section 2.3.3. A brief description of the experimental measurements will follow in Section 2.4. In Section 2.5, we tested this method with the van der Pauw method on a 2d film (Section 2.5.1) and then apply this technique to the data taken from two diamond crystallites and discuss the results (Section 2.5.2). Finally, I summarize the application of the method and give some suggestions in Section 2.6. 2.1.2 van der Pauw formula for 2d film The determination of the resistivity of a regular shaped conductor is simple because it provides a uniform current inside the sample so that a simple relation between the resistivity and even the Hall coefficient and parameters for the sample shape can be given. However, this is not possible in case where a sample is grown and shaped arbitrarily as in Figure 2.4. A method based on the well-known technique of conformal mapping of two—dimensional fields9 to measure the resistivity and the Hall coefficient of 2-dimensional films was developed by van der Pauw.8 This method is very useful to derive those quantities from simple I-V measurements and without considering contact resistances between the sample and contacts by using multi-probe measurements. Suppose we have a flat sample as in Figure 2.4 and the current I ,2 is injected Figure 2.4 The conductivity measurement of 2D film in arbitrary geometry is done by four—probe measurement. from lead 1 to 2 and the voltage V34 between lead 3 and 4 is measured. Then a resistance R13; is defined by V34 / I12 and it is independent of the contact resistances because there is no current flowing through the leads where the voltage is measured. The resistivity p of the sample and 4- -point resistances (R12 , R3) are related by crux-”R 34d)+ex x-p( ”R3331 —=) l (2.2) where R5“ = V," / I u and d is the thickness of the sample. The resistivity p is given by w R34+ R4l R34 p= 1112Mfl R13.) (2.3) where f is a function of the ratio R1324 IR;I only and has a relation R1324 —R;3] = fcosh"{exP(ln2/f)} ' (24) 12:; mg; 2 The Hall mobility can be obtained by the change of R1334 when a magnetic field is applied perpendicular to the plane. A resistance R1234 is given by a cross measurement of voltage and current as done in the usual Hall geometry. If the magnetic induction is B and the resistivity of the sample is known by the previous procedure, _1AR13§‘ — B p 9 (2'5) #H where ARE: indicates a change of the resistance. Usually a clover-shaped sample , shown in Figure 2.5(a), is used to eliminate the influence of the contacts. There are some advantages with this shape compared to the bridge-shaped sample (Figure 2.5(b)). For low electronic mobility, it provides more Hall current at same amount of heat dissipation. Moreover, it has mechanical strength and can be used for small sample. However, this method works only for a situation that satisfies the following conditions. First, the contacts should be located on the circumference of the sample. Although there are some marginally safe regions inside the sample, for instance near the comers of a square sample, generally this condition should be satisfied.10 Secondly, the contacts should be small compared to the sample size. This second condition raises trouble in micron-sized (a) (b) Figure 2.5 A clover-shaped film (a) and a bridge-shaped film (b) are used for four-probe measurement. samples. Moreover, the van der Pauw method requires homogeneous thickness of the sample. Following a 2-dimensional approximation, it does not consider any current variation along the perpendicular direction to the plane. Finally, the sample should have a singly connected surface. There should not be any hole inside the sample, which generates a separated boundary from the outer surface. With these restrictions, it does not help us to calculate the conductivity of three—dimensional shaped microcrystallites. 2.1.3 inverse problem All physical problems might be classified into one of two categories, the direct problem and the inverse problem depending on what is known and what is to be identified in the problem. The term inverse problem can be defined simply as the determination of the causes from the results. It is the opposite to the direct problem that determines the results from the given causes (see Figure 2.6). The direct problem is the determination of some physical quantities (potential, free energy, temperature, current etc.) from the given conditions (geometry, boundary condition, initial condition, and material property). Most analytic problems are usually direct problems. To solve a problem analytically, all necessary conditions that cause some physical phenomena should be defined. Here is a simple example of direct problem. Suppose we have an electrostatic problem to obtain voltage distribution in a spherical conductor that has constant charge distribution. This can be done by solving the Poisson’s equation with the prescribed conditions (geometry, charge distribution, etc.). Even some numerical simulations are also direct problems. One of these examples is molecular dynamics. 11 CAUSES RESULTS - Geometry Direct Problem - Potential - Operator - Current - Material Properties > - Displacement (electric conductivity, - Temperature A ‘ elastic constants, thermal conductivity.) - Boundary Conditions Inverse Problem Figure 2.6 A schematic of the inverse and direct problem. Those two problems can be characterized by what is known and what is determined in the problem. Consider a system consisting of many particles in a fixed volume. This system at a later time can be described by the initial conditions (potential, initial position and momentum of each particle, etc.). All positions and momenta of the particles at this later time can be given by the simulation. However, some problems are quite different from the direct problems. Suppose we determine some physical quantities from experimental data by some fitting procedure. The results (experimental data) are used to find the causes (physical properties). It can be called an inverse problem. The fitting is usually performed to identify the unknown causes from the measured results. The optimization technique can be classified by an inverse problem. It determines some parameters that minimize the measured quantities (energy, power, 12 etc.). Suppose we have a heat conduction problem as in Figure 2.7. Given a temperature distribution at an initial time t = 0 , find the temperature distribution on the bar at later time t. This problem is a direct problem because the solution of the 12 Figure 2.7 Heat conduction problem on a simple bar. temperature distribution is determined by the initially given conditions. And this problem is a well-posed direct problem because the temperature distribution at time t can be determined uniquely from the given conditions (temperature distribution at t = 0 , heat capacity cv of bar, and boundary conditions on the surface) and the heat conduction equation governing the analysis.ll However, if we solve this problem in a different way so that the initial temperature distribution on the bar should be found from the temperature distribution at later time t, it is an inverse problem. This problem is an ill- posed problem that does not have a unique solution because the temperature distribution function T(x) in all regions of the bar cannot be determined from a finite number of measurements of the temperature distribution at time t. Tikhonov developed a regularization technique to solve a problem that cannot be solved by normal methods like the inversion of linear equations.12 However, this regularization is not needed for our problem that is a well-posed problem. Enough information is available to extract the unknown parameters in our problem. We will determine the conductivity of the sample and the contact resistances where the unknown parameters are fewer than the measured (known) resistances provided by the multi-probe method. In our problem, the I-V characteristics of the crystallite can be viewed as results and we identify the conductivity and contact resistances as causes. Suppose o is a field variable representing a physical state of the system, which is a response to an applied force f. Then a governing equation can be written as Eq. (2.6) where L(k) is an operator and k denotes material properties of the system. L(k)¢ = f . (2.6) The inverse problem is, given the response 41, and the applied force f, to determine any missing information involving geometry, operator form, boundary conditions and material properties. Our problem can be more specifically classified as a material property inverse problem following the classification of Kubo.l3 He suggested that inverse problems could be classified depending on what quantities to be determined. There are five main inverse problems; domain/boundary problem (that includes electric potential computer tomography (CT) method, inversion scheme for electric potential CT method, crack identification), governing equation inverse problem, initial/boundary value inverse problem, force inverse problem, and material property inverse problem. In our problem for the determination of the conductivity of a material with a complex geometry by multi probe I-V measurement, the applied force f is the current and the response is the potential. We know the form of the operator L defined by the analysis type. The unknown quantity that we need to identify in this problem is the conductivity as a material property. 14 2.1.4 Finite Element Method (FEM) Initially the finite element method has been developed for the analysis of structural mechanics because of its excellent applicability to complex geometry analysis. It is a very efficient way to analyze the mechanical property of an object with irregular shape. However, it has been recognized it could be used to solve other problems like electromagnetic, heat conduction, fluid mechanics, acoustics, and piezoelectric studies. This method can be extended to dynamic problems as well as static. There are numerical methods such as finite difference method (FDM), Monte Carlo, spectral, variational method for solving a partial differential equation. However, the finite element method is considered the most efficient for a study in a complicated and highly irregular geometry. Only a few geometries of boundary value problem can be solved analytically even for simple partial differential equations like Laplace’s equation. Such geometries might be line, square, circle, sphere, and cylinder. However, most real problems generally have very complicated shapes compared to these simple and ideal structures. Some problems of irregular shapes might be solved by using the perturbation method. Otherwise, it should be approached by successive numerical approximations. Suppose we solve a boundary value problem as in Figure 2.8 and the inside domain is governed by a partial differential equation AI]! = f , (2.7) where A is an operator that may represent Laplace’s equation, Poisson’s equation ,or heat conduction problem depending on the type of analysis. f can be any type of source as charge, heat source, and so on. The solution 11!, which represents voltage (electromagnetic) or temperature (heat conduction), can be solved by well-defined 15 SI Figure 2.8 A boundary value problem is solved in this irregular geometry. Boundary conditions on each surface are needed. boundary conditions on the surface of the domain as 1;! = We : Dirichlet condition (2-8) 811,; = V’o' : Neumann condition , (29) n where div is a normal derivative of up. Since our problem is electrodynamic analysis of n a diamond crystallite, Laplace’s equation should be satisfied inside the region when there is no static electric charge in the sample. We need Dirichlet conditions as boundary conditions on the leads (SI, 82) where specific voltages are applied. Neumann condition on the other surface S3 with I/lo'= 0 is given as no current flows through the surface. These boundary conditions can be represented by VZV =0 (2.10) V: V0 onSl,V=0 MS; (2.11) ri-E=0 ons3, (2.12) 2.1.4.1 preprocessor There are three main procedures in FEM, the preprocessor, analysis, postprocessor. The preprocessor generates geometry and initial conditions of the problem. Initial conditions consist of the construction of the geometry, meshes (nodes and elements), boundary conditions, and material properties. In the procedure of geometry reconstruction, we need to have the coordinates of vertices, faces and their connectivity. We developed an algorithm to reconstruct a 3d sample from 2d SEM pictures.14 The coordinates of the sample vertices obtained by this technique are used to generate the geometry of the computer model in the FEM analysis. This process to build the computer geometry is one of main steps in the preprocessor. Some commercial FEM packages including AN SYS provide a CAD type utility for this process. The computer model consists of lines in 1d, areas in 2d and volumes in 3d. The whole domain of the model should be divided into subdomains if different materials are involved in the analysis. Each material is assigned to a given subdomain. After the construction of the geometry, this whole domain should be meshed into /[\. Figure 2.9 Some typical element shapes are presented for FEM. Each element has nodes on the vertices or some extra nodes on the edges to enhance the accuracy. l7 the elements. Each domain of the volume should be meshed separately. These elements are the most important objects in FEM, where the analysis is performed inside. Each element is defined by nodes, lines, and facets as in Figure 2.9. Elements can be lines in 1d, triangles, squares, honeycombs in 2d, and tetrahedras, cubes in 3d. However, highly distorted elements as in Figure 2.10 are not recommended because they may cause serious numerical errors in simulation. Following the defined shapes and sizes of elements, the whole domain can be covered by the elements as shown in Figure 2.11. Apparently finer meshes can generate more realistic shape for a complex structure and can enhance the accuracy of the simulation. However, many meshes increase degrees of freedom so that the performance of the simulation would be limited by the computing power. A spherical object is one of the most complicated structures to mesh well. All boundaries of elements are defined by a line segment in 2d, plane in 3d. A curve in 2d or a curved plane in 3d cannot be used for the boundaries of the elements. A circle in 2d can be meshed only into a polygon. It may cause a serious problem in the numerical analysis of two adjacent circles. Except for these extreme structures, the meshing itself is not so . « '5" Figure 2.10 Highly distorted elements are not usually acceptable in mesh generating. l8 Figure 2.11 A sample of meshed geometry with square-shaped elements in 2d. important in the numerical simulations. The meshing generates the coordinates of all nodes and defines the topology of each element defined by these nodes. This information is moved into the next stage of analysis. 2.1.4.2 analysis In the analysis procedure, a function is defined inside each element. As mentioned earlier, since the physical quantities in the problem are represented only on the nodal points at the boundaries of elements, they are not defined yet inside the elements. We express the physical quantities (voltage, displacements, etc.) in terms of the functions whose magnitudes are defined on the nodal points. This function is interpolated to generate physical quantities inside the elements. This property is the main difference with the finite difference method (FDM), which is very similar to the FEM in many aspects. All variables, including first and second derivatives of the physical quantities, can be obtained by the interpolation of this function inside the elements. The next equation is one example of this function defined by the basis function ¢i~ q ‘l’ = X‘Pflli (2.13) '=1 where (1),- is a known basis function and u, is an unknown coefficient (Ritz coefficient).'5’16 We have q unknown coefficients here. In FEM, the basis functions are selected to calculate the physical values inside the elements. Then all values in the whole domain can be represented by the coefficients and the physical quantities on each node. The global potential energy is represented by the sum of the local potential energy defined for each element. The variational principle is applied to find out the values of won the nodes. By solving for the coefficients in the above equation, we can construct the functional wand obtain the physical quantities in the whole region. One choice for the basis functions is orthogonal polynomials. The degree of the polynomials is an option to enhance the efficiency of the analysis. However, the increase of the degree of the polynomials means the increase of degrees of freedom so that it causes a memory problem in computing. We have a trade off here between the accuracy of the simulation and the limit of computing power. This trouble happens similarly in the mesh generation as mentioned in the previous section. The finer mesh gives a better result, but it increases the number of nodes where each functional tilis defined. After setting up the functionals of the physical variable, we solve the boundary value problem inside the elements. That means we have the equations of the unknown coefficients by solving the differential equation and applying the boundary conditions between the elements and their adjacent 20 elements. The boundary conditions should be the continuity relations of the physical quantities around the boundary of the elements. The first derivative of the variable also should be continuous. For instance, the voltage and electric field on the boundary between two finite elements should be continuous. Then, the potential energy of each element is represented by the unknown coefficients and combined together for the global potential energy II as in IT = J¢du 2*- 2(1)].(uij) . (2.14) j=l The variational principle should be applied to minimize the potential energy functional II. The unknowns are the nodal point variables that are related to the unknown coefficients in Eq. (2.13). The global function 11 would be the electric power in electrodynamics, potential energy in electrostatic, heat dissipation in heat conduction, and elastic potential energy in the structural mechanics. In the variational method, the functional should satisfy the minimization condition of L“ = 0, i=l,..,n (2.15) (911,. where the approximate solution is given by u" =fif,a,. (2.16) i=1 where j". is a Ritz function equivalent to a basis function and a, is a Ritz parameter. In this procedure, the correct boundary conditions of u" should be applied on the surfaces and the differential equation should be satisfied inside the complete domain. By solving the minimization method, the physical quantities on all nodes and the unknown 21 coefficients (Ritz parameters) are determined. Those values generate a complete solution for the whole region. 2.1.4.3 postprocessor In last step of postprocessor, a complete solution has been obtained for the whole region. Since each variable on the node is given by the analysis, values inside the elements can be determined by the interpolation of the functional in Eq. (2.13). From the given quantities on the nodes, we can calculate other information. For instance, we solve the electric conduction problem using only one variable that is voltage. However, after the voltage on each node is obtained from the analysis, the current flow can be calculated from the electric field and the conductivity of the material. The postprocessor provides the visualization of the results by the interpolation technique; the contour map of voltage, current, stress and strain distributions as presented in Figure 2.12. This is a very useful and fast way to check if the simulation works well. More detail about FEM can be Figure 2.12 By the FEM analysis, a voltage distribution on a sample is obtained. The interpolation technique is used to obtain the distribution inside the elements. 22 found in other references.” 18' '9 2.2 Theory 2.2.1 conductivity and geometrical factors For a complicated geometry, the conductivity cannot be determined directly from the measurement of the resistances since we measure the voltage and current that depend on the geometry. We cannot separate the conductivity (geometry independent) from a resistance (geometry dependent). Thus, we define a geometrical factor that only depends on the geometry to treat the conductivity separately from the resistance. At this moment, the contact resistances are neglected. The way to treat contact resistances (Ohmic and non-Ohmic) will be described later in Section 2.2.3. When we measure the voltage V and current I in a sample like Figure 2.13, a resistance is defined by R=_=_,__'_,=ir=pr , (2.17) . . S 0' Figure 2.13 For 2-terminal measurement, the voltage is calculated by a line integral along the path I and the current is obtained by a surface integral on the cross section S. 23 where we assumed the conductivity tensor is isotropic; otherwise acan not be taken out the integral. A newly defined quantity I‘= I E - dl / IE ~ d8 in this relation depends on the geometry only, not on the absolute value of the conductivity. Suppose we have a sample with four probes as in Figure 2.14, 36 resistances can be defined from six measurements of voltage and six measurements of current. We can represent each resistance with a corresponding quantity I‘ defined in Eq. (2.17). From a voltage between two leads I, m and a current through i, j, a resistance R5" is defined in the same manner. jiiai jaw” R5" =¥1=§ =—'j——=pr;" (2.18) pas dyad“ We call the quantity 1‘5.“ defined in Eq. (2.18) a geometrical factor. By defining this Figure 2.14 Showing a conductor that has four probes that are attached on the surface. 24 geometrical factor, the conductivity (which is a constant as an intrinsic material property) can be separated from the resistance. This geometrical factor F is given by L / A for a simple geometry of cylindrical shape, where L is a length and A is a constant area. However, in most cases it can not be obtained by this simple form because of complicated geometry that induces a complicated non-uniform current pattern. Following this definition in Eq. (2.18), each resistance has its corresponding geometrical factor with the conductivity as a scale factor. These geometrical factors can be given by a numerical simulation described in Section 2.1.4 using unit conductivity. These calculated geometrical factors will be used later to determine the conductivity by fitting with resistances given by the experimental measurement. 2.2.2 resistance table and its properties In a multi-probe measurement, we can define many different configurations for the resistance measurement depending on how to choose the leads for voltage and current measurement. All possible measurements provide a set of resistances that forms a matrix, a so called resistance table. One of the diamond crystals (Sample 2) with contact pads prior to lithographic lead attachment is presented in Figure 2.15. In a normal multi-probe measurement, contacts are attached on the surface of a sample and the I-V characteristics are measured. At least four contacts are needed to obtain contact-free resistances. Although we have five pads on the surface in this sample, four of the five pads were used for the measurement, with the furthest to the left having no lead attached. This pad was at a 25 Figure 2.15 Micron-sized diamond crystal grown by a chemical vapor deposition technique before Au leads were attached. Five titanium contacts were formed on the surface and four of them (indexed) were used for the measurement. constant (but initially unknown) potential that was determined by the finite element code. With the four probes for the I-V measurement, a set of resistances can be given by all possible voltage and current measurements. This set is called a resistance table that has all necessary information of the sample conductivity and contact resistances. A current I 1.]. flows through the terminal i, j and a potential difference Vb" is measured across terminal I, m. We can define a (signed) resistance R5" = V," / I. which reduces to the standard ,1. definition of resistance (2—terminal resistance) when i, j = l,m . With this definition of resistance, we can generate a resistance matrix as Table 2.2 formed by V,"I column and I ,1. row for all possible combinations. This set of measurement forms a "C2 (= n(n — l)/2) by "C2 resistance matrix of all possible pairs of current terminals and voltage terminals but there are only "C2 independent elements in this matrix because of the following constraints. For an Ohmic sample, the matrix is symmetric under the exchange of current and voltage terminals, Le. 26 Table 2.2 A resistance table from all possible combinations of voltage and current measurements. R g" Vl2 Vl3 V14 V23 V24 V3,, 1'2 R1122 R1123 R112 1‘3 R133 R11; 1” R11: ’23 R333 1,, R23: 1,, R33: 27 i’ I" m V Rd. =73 = R;- = J- (2.19) m 9 1m [if where V0. is the voltage between the leads i, j and I ,m is the current between the leads I, m. This is a reciprocity theorem,20 which is proved in the Appendix A.1 for the present geometry. Along any row of the resistance matrix, the current I ,m is a constant, and the voltage is a scalar potential that satisfies %=%+%. em Thus, the resistance elements have the additive property R1} = vi)“ = Vr'k +ij Im II I = Riii. + Riff. . (2.21) lm m Using these two rules, we can show that there are only ”C2 independent elements in the resistance matrix by the following construction: Consider the n —1 elements (R13; , i = 2,..,n) in the first row of the resistance matrix. These terms can generate all the other elements in this row using the addition rule Rg=Rg—Rg, am) where i < j = 2,..,n. Note that changing the order of the indices changes the sign of the resistance. In the second row, only n — 2 elements of R1]; (i = 3,.., n) are needed to construct the remaining elements in that row because, by the reciprocity theorem, R}; = R3 and R3 was given in the first row. Continuing in this manner we need n —1 terms in the first row, n - 2 terms in the second row, for a total of 28 n(n — 1) (n-1)+(n—2) +....+2+1 = ="C2 (2.23) independent elements. There are many possible choices of the "C2 independent elements, but they cannot be selected arbitrarily. By the above construction, the (n — 1) by (n — 1) upper diagonal block forms one independent set. Surprisingly, the "C2 diagonal elements (the set of 2 terminal elements) also form an independent set, related to the off diagonal elements by jl im _ jm _ 1'! R jl + Rim R jm Ril lm _ RU. _ 2 (2.24) This relation means that knowledge of only the 2-terminal measurements can be used to generate the complete resistance matrix, which can be used as a useful self consistency-check on the experimental results. Table 2.3 shows how the diagonal terms reconstruct the whole resistance table. Three off-diagonal terms in the triangular matrix in the bold box can be obtained from the six diagonal terms by Eq. (2.24). Six terms in the bold box was already shown to generate the whole matrix in Table 2.3. In Table 2.4, I summarized how the number of elements of the resistance matrix, and the number of independent elements depend on the number of terminals. We need at least four terminals to extract the resistivity p and the contact resistances because otherwise there are more unknowns than independent terms. As an example, consider the case for four terminals (n = 4) shown in Table 2.4. There are six ways to select two of four terminals and so there is a 6 by 6 resistance matrix with six independent elements. The six diagonal elements form the most 29 Table 2.3 How to generate the triangular matrix from six diagonal terms so that the triangular matrix produces a whole table R3" VIZ VIS V14 V23 V24 V34 1.. 11:; R3 +14: we 11:: +14: 42:: 2 2 [13 R11; Rii 1' R1]: " R3: 2 Ii. R13: 123 R 2233 12. R22: 1,, R332 Table 2.4 The number of independent elements in a resistance table. Number of Dimension of Elements in Independent Unknowns Terminal Resistance Table Resistance Elements ( p , contact Table resistances ) 2 l 1 1 3 3 3 9 3 4 4 6 36 6 5 5 10 100 10 6 6 15 225 15 7 " "c2 =n(n—1)/2 ["c2]2 "C, =n(n—l)/2 n+1 3O important set of independent elements from which we can use Eq. (2.24) to obtain the three off-diagonal terms, R1123 , R11; , R11; as shown in Table 2.3. The 3 x 3 upper diagonal block (shown inside the bold line in Table 2.2 and Table 2.3) is an alternative independent set that can be used to construct the entire matrix using the procedure outlined above. However, it is interesting to note that the set of 4-terminal measurements is not all independent. Note that by Eq. (2.24), only two of the 4-terminal elements are independent with R3; = R3: + RS; . (2.25) As a result, a set of six terms including three 4-terminal measurements cannot be used to reconstruct the whole resistance table. It is important to note that the above analysis is only true for samples where the I- V curve is independent of the current direction (otherwise the reciprocity theorem fails).20' 2‘ Some of the experimental data analyzed in Section 2.5.3 has non-Ohmic characteristics indicated by asymmetry of a table, and so the resistance matrix has more than 6 independent elements. The necessary modifications to the above analysis are model dependent, and will be discussed for the specific situation of the experiment. 2.2.3 contact resistances In two previous sections, it has been found that the geometrical factors separate the unknown conductivity from a resistance. However, the contact resistances should be considered in 2-terminal and 3-terminal resistances. The measured resistances include the contact resistances, so the representation of the resistances should be modified. We 31 Figure 2.16 Contact resistances have two different values (r, , r,. ') for non-Ohmic contacts. A resistance measurement consists of a sample resistance Rum and contact resistances added in series. Table 2.5 Resistance table with two contact resistances for current flows. Riljm Viz VI} VI4 V23 V24 V34 112 pl“),2 + rl + rz' pl‘1‘23 + rl p131;t + r1 P1753 - 72' pl": ” ’2' P 1324 1,3 p11; + ’1 pi]? + r1 + r3' p11: + rl p113,3 + r3' pI‘lza4 p17,? — r3' 1,, p113 + r. pFi'i +ri PW: + n + '4' p11? p113.“ + r.‘ pF.3.“ + r.‘ 123 prz‘i - r. p1“); + r,‘ tori; PF2? + '2 + '2' 10132: + 4 p133: - r.‘ 124 pm? - r2 pFi‘i‘ pFlZ + r.‘ p133} + r. PF2? + '2 + '4' pl"; + 0' I34 p133} p133,3 — r3 p1“;3 + r,‘ pl‘ff — r3 p133: + r4' p133,4 + r3 + r,‘ 32 assume these contact resistances can be added in series to the sample resistance because the contact area is assumed an equipotential due to the high conductivity of the Au/T i contact pads. This leads to Rim =priim+’i'(5u"5im)+rj(5jm—6fl) , (2.26) where 1;. is the Ohmic contact resistance of terminal i and 5,]. is Kronecker delta function. However, contact resistances are generally non-Ohmic which is indicated by non- symmetric three terminal elements in the observed resistance table. We assume that the sample itself is Ohmic, which is justified if the four terminal elements are symmetric. Since the I-V characteristics are non-linear and not symmetric for non-Ohmic behavior of the contacts, each contact has two independent resistances for the two different current directions [i.e. current reversal with the magnitude of the current held constant]. To investigate such non-Ohmic I-V characteristics of a contact, we used two fitting parameters, 4, ’1' corresponding to the two contact resistances for constant current flow as in Figure 2.16. If r, is a contact resistance when a current is flowing into the sample and '1' is for a current flowing out of the sample, then Eq. (2.26) is modified to become R5?" = p13.“ + r, (6,, — 6m) + 5.16),, — 6],) (2.27) to be a more general expression for non-Ohmic contacts. The whole expression of the resistance table following the relation of Eq. (2.27) is given in Table 2.5. 33 2.3 Computer Simulation 2.3.1 reconstruction of 3d computer image In FEM, all the information of the sample geometry is needed for the preprocessor that constructs a computer model for the analysis. It may include the coordinates and topology of all vertices, lines, planes, and volumes associated with the sample shape. However, since our samples are micron-sized crystals, it is not straightforward to measure the shape of such small objects. One way is using electron lithography to get the SEM (Scanning Electron Microscope) photos. An inverse ray tracing technique is used to reconstruct the three dimensional object that will be used in simulations. Ray tracing is a computer process used to create a two dimensional representation of a three dimensional object by tracing the path of the ray of light between the light source, objects, and an observer.22 We apply this technique in reverse to construct a three dimensional image from the two-dimensional SEM photos. Since these photos were only two dimensional, we needed several pictures taken along different viewing angle sample y X Figure 2.17 Each SEM photo is given in an orientation for viewing angle (6, ¢) as shown in this figure. 34 (C) (d) Figure 2.18 SEM photos of a sample (Sample 2) in various orientations. (a) 6, ¢ = 0° , 0° (b) 0, ¢ = 50° , 0° (c) 0, ¢ = 50° , 90° (d) 9, ¢ = 50° , 270° 35 orientations defined by viewing angles in Figure 2.17. Figure 2.18(a)~(d) present four different pictures projected in each direction before gold leads are attached on the five contacts formed on the surface. In this sample, contacts were located on the upper surface since it has been formed by the electron beam along the vertical direction. Therefore, the picture in Figure 2.l8(a) taken along the same direction shows most of the detailed geometry. However, some contacts were observed smeared down the surface (see Figure in 2.18(c)). This contact formed a wide contact area that could affect the I-V measurements. For a more complicated contact formation or some serious deformations in the lower part, it is necessary to select all viewing angles carefully to take the whole geometry of the ‘1‘ -..- m.‘ m sample. After taking these SEM pictures, the coordinates of all vertices of the sample and contacts were digitized on each photo. The algorithm treats the crystal as an irregular polyhedron and attempts to assign coordinates to the vertices in a way that is consistent with the SEM images. From each picture of the crystal we can measure the projected length of an edge of the diamond crystal, and compare it with the projected length calculated from the assumed vertex coordinates. The vertex coordinates are adjusted to minimize , 1.4.55“ '2 x, =2[' 6? ]. (2.28) where ll. is a calculated projected length, If” is the projected length from the SEM and o". is an estimate of the experimental error in measuring [1.35M . The sum is over all edges visible in each picture, and over all pictures. The positions of the contact pads are determined by including the coordinates of the comers of the contact pads, and the lengths from the comers to some of the crystal vertices. Taking pictures from enough 36 different orientations to ensure that every edge was visible in at least two images was adequate to ensure that we could construct a representation of the sample that matched the SEM images very well. Because we knew that the sample was a single crystal, we added some additional constraints to the minimization process. Specifically we required the facets to be planar, and the facet angles to conform to the known facet angles of the diamond structure, e. g. 70.5° or 109.4° between different (111) facets. The flatness constraint was achieved by adding to 12 the term 22? (r —-—c-‘)2], (2.29) where if). denotes j—th vertex coordinate in i-th facet and E. is a constant vector that is normal to the i-th plane. The facet angles are constrained by adding to 12 a term 6 _0 theory 2 1,3 = [.-_.-__:| , (2.30) where the facet angles 9,.”"0'3’ are those appropriate for a diamond structure. The sum is over pairs of facets. The 0",.” in Eq. (2.29) and of in Eq. (2.30) are standard deviations denoting the weighting factors for each constraint. Although it is arbitrary how these factors are assigned, they should be larger than the standard deviation associated with the edge lengths I, because these lengths could be determined very easily and directly from the SEM photographs. 12 =x,2+xp2+xf2. (2.31) The total 12 , the sum of the three quantities in Eq. (2.28)~ (2.30) is minimized by adjusting the vertex coordinates using a standard non-linear minimization routine.23 The 37 final coordinates associated with the minimized 152 were used as the input for the current flow analysis that was done using the finite element method. After this optimization procedure, we obtained a computer model of the sample. It provided all information about the geometry defined by the coordinates of vertices and the connectivity of planes and volumes. Nearly 80 vertices were needed in our models and most vertices were for the contacts. The contact areas have been constructed very carefully since the transport in the sample mostly depends on the area. By initially assigning high conductivity to the contacts, the contribution of the contacts to the resistance measurements was determined only by the effective area for the current flow. We attached five contact pads in the shape of small pyramids on the sample as in Figure 2.19. Although only four contacts of five were used for the real measurement, we made the fifth contact also to generate the equipotential area below the contact. Figure 2.19(a) and (b) shows two views of the computer model (Sample 2), which correspond to the (a) (b) Figure 2.19 Computer images reconstructed from SEM photos by image processing. Five small pyramids on the surface denote five contacts. Compare these two images with the SEM photos in the Figure 2.18. 38 SEM image in Figure 2.18(a) and ((1) respectively. It was not possible to observe the bottom of a sample because of the Si substrate. Some diamond crystallites may have an unusual structure of local defect below that cannot be identified in the SEM photos. However, usually it does not contribute significantly to the transport as much as the top part of the sample does. On the surface near the contact pads, a large variation of current flow was observed. However, it was not so on the surface below where no contact pads were formed. 2.3.2 modeling and analysis using FEM 2.3.2.1 modeling (preprocessor : ANSYS) After the geometry reconstruction, I did the simulation using the finite element method to solve the electrical conduction problem. All FEM tasks in this problem were performed by the commercial packages AN SYS24 and ABAQUS”. ANSYS 6.1 was used for a preprocessor (mesh generating) and the other processes (numerical analysis and post processor) were done by ABAQUS 5.5. In modeling by AN SYS, I generated volumes that correspond to the sample and contacts. Since our sample had highly irregular geometry, it was not straightforward to generate the structure. Some simple structures (squares, circles, bricks, spheres, etc.) can be constructed by giving a few coordinates and geometrical parameters. First, it begins with the formation of keypoints for all vertices of the sample and contacts. Planes for the volume construction are made by linking the keypoints that are associated with a plane. Some vertices of a plane may not be located on the same plane even after the geometry optimization with the constraint of a flat plane. AN SYS does not allow making a plane by linking these vertices. All keypoints should be 39 (b) (C) Figure 2.20 Triangular planes generated from three keypoints were combined into a large plane as shown in (a). A volume could be constructed by connecting these large planes into a volume unit. The volume elements for the diamond crystallites were presented in (b) and (c). 40 on the same plane to construct a plane. Thus, a triangle plane was used to overcome this trouble. Suppose we need to make a plane structure by four vertices (1, 2, 3, 4) in Figure 2.20(a) and the vertex 4 is not on the plane defined by the other three vertices (1 , 2, 3). Then we make two triangular planes and connect them to form a folded plane made of four vertices. Most planes in our samples were constructed in this way as shown in Figure 2.20(b) and (c). A volume was constructed by combining these planes. Figure 2.20(b) and (c) present the structured volumes of two diamond crystallites before the meshing. Both of our samples consisted of six separated volumes (one huge volume for the sample and five small pyramids for the contact pads). Different material properties could be assigned to the separated volumes in the FEM analysis. After constructing these volumes, we need to select the type of element for the meshing. Element types are selected depending on the dimension and the analysis type. Figure 2.21 shows the element shapes used in the meshing of the diamond film (2d) and the crystallites (3d). For the analysis of electrical conduction in 2d, AN SYS provides triangular elements with three or six nodes and squares with four nodes or eight nodes. In 3d, we can use cubic elements with 8 or 20 nodes and tetrahedral elements with 4 or 10 nodes. Tetrahedral elements were usually used to mesh an irregular shape in 3d where it was not done by cubic elements. Tetrahedral elements with four nodes were used for the diamond films and one diamond crystallite (Sample 1) and tetrahedral elements with 10 nodes were used for the other diamond crystal (Sample 2). The diamond film was meshed by square elements (2d) as well as tetrahedral elements (3d) to test whether the 2d approximation of the film was valid in the simulation. Figure 2.22 shows the meshed structures of all samples; a diamond film(a) and crystallites ((b) and (c)). 41 Figure 2.21 The elements used for the meshing of 2d film (square) and 3d crystallites (tetrahedra). Sometimes elements that have only four nodes on the comers were used. Table 2.6 The characteristics of the meshings for each sample. Homoepitaxial films Sample 1 Sample 2 Element type DC3D4 DC3D4 DC3D 10 Nodes per elements 4 4 10 Total Nodes 800 1100 4700 Number of elements 2300 5500 3300 42 (b) (C) Figure 2.22 Meshed structures of the diamond film(a) and crystallites (Sample 1(b), Sample 2 (c)). Figure 2.20(b) and (c). Each model has square-shaped contacts on the surface. 2.3.2.2 analysis (processor : ABAQUS) The meshed structures given by ANSYS were delivered to ABAQUS for the analysis. All coordinates of nodes and the topology of elements were used to generate an ABAQUS input file that includes all necessary information for the analysis; material property, boundary conditions, and output format as well as the geometry. Since ABAQUS does not provide the electromagnetic analysis, the heat conduction analysis was used. Both analyses follow the same differential equation, Laplace’s equation with no charge and heat source. The temperature in the heat conduction analysis is equivalent to the voltage in the electric conduction analysis. The heat flux and the thermal conductivity correspond to the current and the electric conductivity respectively. By these correspondences, the electric conduction problem could be solved by the heat conduction analysis using ABAQUS. In the heat conduction analysis, the temperature is the only degree of freedom that is defined on each node. By minimizing the heat dissipation defined by the temperature, the solution on each node could be obtained under the subscribed boundary conditions and the material properties. After the temperatures on every node were obtained, the heat flux could be determined from the derivatives of the temperature functions and the thermal conductivity. An electric resistance could be defined by the temperature (voltage) and the heat flux (current). Some details of these procedures were described earlier in Section 2.1.4.2 and the rest can be found in some other references or ABAQUS manuals.25 Our main object in this analysis is to obtain the geometrical factors, not resistances. They represent the shape factors that are not related to the intrinsic material property (conductivity). To obtain these factors in this analysis, unit conductivity is given 44 to the conductor. Then, the resistances calculated from the voltage and current given are equivalent to the geometrical factors Fifi.” . In the absence of any contact resistances, these factors are related to the resistances R5" by a simple linear relation of lm _ lm RU — p11,. . (2.32) All possible combinations of the current and voltage measurements generate a 6 by 6 geometrical factor table. These geometrical factors include any information of complex current paths across the arbitrarily shaped sample for each combination. 2.3.2.3 contour map (postprocessor : ABAQUS) From the analysis in the previous section, the voltages only on the nodes were obtained. Inside the elements, the equipotential lines were calculated from the interpolated functions of the voltage. The contour maps of the voltage distributions on the sample surfaces are shown in Figure 2.23 for a selected configuration of the current and voltage measurement. The current flows from the red pad (high potential) to the blue pad (low potential). The voltage distributions are indicated by the contour map. Figure 2.23(a) presents the potential distribution on the surface of a film. Figure 2.23(b) and (c) present the potential distribution of a crystal (Sample I) viewed by different orientations. Figure 2.23(d) and (e) show the similar contour maps of another crystal (Sample 2). Figure 2.23(b) and (d) were viewed by the vertical direction (view point =(0, 0, 1)) and Figure 2.23(c) and (d) were rotated and shown by a different View point (1, -1, 1). By assigning high conductivity ( > 106 ) to the contacts and unit conductivity to the sample, the contour 45 (d) (6) Figure 2.23 Equipotential lines on the surface of the samples given by ABAQUS. (a) is for homoepitaxial film. (b) (c) are for Sample 1. (d),(e) are for Sample 2. The figures of 3d samples were obtained in different orientations. 46 maps show the constant potential distributions on all contact areas including the lead-free contact as expected. 2.3.3 least square fitting Table 2.5 in Section 2.2.3 is a modified resistance table for a 4-terminal problem showing each element in terms of the sample resistivity p, the geometric factors 1“,?" and 6 of the 8 contact resistances (rl , r2 , r2 ' , r3 , r3' , r4 ' ).26 Another table for reverse current flows is necessary to extract all the contact resistances for non-Ohmic contacts. From these two tables given by opposite current directions, a resistance can be defined as R1?" = P135" +7.-(5.-i JANE-(5).. —5,-i)+Ari(5.-i *5im)-Ar,-(5,-m -5,-i) (2.33) where _ l , and 1 . An=-2-n—n). (2.35) A similar resistance table with both current and voltage leads reversed enables us to construct an Ohmic resistance table RE“ = (R53 + Rf,“ )/ 2 which is shown in Table 2.7, and the non-Ohmic resistance table M3?” = (R? — R7,.“ )/ 2 , shown in Table 2.8. Note that the Ohmic resistance table displays all the symmetries of the analysis in Section 2.5.2, and in particular, only the six diagonal (2-terminal) elements are needed to generate the entire table. For the non-Ohmic resistance table, the six diagonal elements only 47 Table 2.7 The Ohmic resistance table obtained from Table 2.5. (symmetric) f?- Vrz VI3 Vi4 V23 V24 V34 112 Frizz + 7'1 + 72 131-1'23 '3' 71 [71.1124 + 7"] 13131223 - 7'2 Frizz4 _ 72 1,11324 1.. 1111?”. pr}: +4 +4 pri‘: +F. 10113.3 + F. p113.“ p113: -F. I” p F1142 + Fl PIT: +71 Fri: + F1 '1’ F4 pr}? [713114 + 74 [31—1344 + F4 12 — 13 — 14 23 - — 24 - 34 - 123 Przs “’2 pF23 +"3 Prza 131-‘23 +"2 +"3 przs + '2 przs ’ ’3 I 2. p133 - F. pri'i p1“): + r, prjf + 7, m3: + F. + F. pl‘i’: + F. 12 13 — 14 — 23 — 24 — 34 - - 134 Pr34 Pry —r3 pram +"4 p134 -r3 pr” +"4 p134 "H3 +r‘ Table 2.8 The non-Ohmic resistance table obtained from Table 2.5. (non-symmetric) AR Viz Vrs Vr4 V23 V24 V34 I ,2 Ar. - Ar; Ar; Ar; Ar; Ar; 0 I ,3 Ar] Ar] - Ar3 Ar] - An 0 Ar; I 1 4 Ar] Ar] Ar] - Am 0 - Ar4 - Am 123 - Arz - An; 0 Ar; - Ar3 Ar; Am I 24 - Arz 0 - Ar4 Ar; Ar; - Ar4 - Am I 34 0 - Ar3 - Am An - Am An - Ari; 48 determine the off diagonal elements up to an arbitrary constant. To determine all the Ar; it is necessary to have at least one of the 3-terminal elements. For this model, the non- Ohmic resistance table is independent of the resistivity, because we have assumed that the material itself is Ohmic. Because the geometric factors are known from the FEM, we can in principle obtain the resistivity and the contact resistances by doing a least squares fit for the expressions intheoretical resistances (Table 2.7 and Table 2.8) and the measured resistances; i.e. we minimize a x2 defined by 2 X2=2|:Ri —Ri'(p9r):l , (236) i of where R f are the experimental measurements and R} (p, r) are the theoretical resistances defined by Eq. (2.33) as a function of the resistivity p and contact resistances r. The sum is over the elements of the resistance matrix used for fitting and o". is a standard deviation of each experimental measurement, which includes both errors in the resistance measurements. The errors in the geometric factors might be from the incorrect computer modeling of the geometry as well as the small numerical error in the FEM. In practice, the least squares fit is best done separately for the Ohmic and the non-Ohmic parts (Table 2.7 and Table 2.8). The practical details of this fitting will be discussed in the next section, when it is applied to our two samples. 49 2.4 Experiment 2.4.1 sample preparation In this section, several experimental processes of sample preparation, contact formation, and the I-V measurement by multi probes will be briefly described. Details of this work can be found in J aeger et al.27 The experimental measurements have been done on homoepitaxial diamond films and microcrystallites. The films were grown on the diamond substrates where as the microcrystals were grown on Si substrate. Since the conductivity of diamond crystallites has not been measured before in highly irregular geometry, our technique should be compared with a well-known method. We chose the van der Pauw method on the conductivity measurement of a 2d film. The conductivity of a 2d film can be given by the van der Pauw formula in Eq. (2.1), thus our result can be compared with the result from this formula. The size of a homoepitaxial film (Figure 2.24) is 3 x 3 mm2 and its thickness is 1.86 um. It is a good two-dimensional object. The I-V measurement was done twice on the same film with different contact formations. Once it was done with a film with four contacts as in Figure 2.24(b). Later two more contacts were attached on the same sample as in Figure 2.24(c) and the measurement was done again. However, only four contacts (gray pads in the figures) were used for the measurement in both cases. Figure 2.25 presents two SEM photos of the CVD diamond crystallites whose conductivities were measured by our method. Although both samples had five contacts, only four contacts were used for the resistance measurement. Two crystallites were grown in the same condition. However, a twin boundary between the contacts was observed in one of the 50 1:1 1:1 1: E1 2 3 2 3 1:11 4121 1:1.1 4- (a) (b) (C) Figure 2.24 A normal picture of the 2d sample (diamond homoepitaxial film) is shown in (a). Two schematics ((b), (c)) of the sample denote the positions of the contacts. Film 1 (b) has four contacts and film 2 (c) has six contacts. Gray— colored squares in the figures represent the contacts actually used for the measurement. (a) (b) Figure 2.25 Two micron-sized CVD diamond crystallites, Sample 1 (a) and Sample 2 (b). Sample 1 has Au leads attached on the Ti contacts and Sample 2 is a shape before the lead attachment. 51 Table 2.9 The characteristics of CVD diamond samples. Sample Description Diamond film Homoepitaxial film on single crystal (100). (homoepitaxial) Natural diamond substrate. Dimension : 3.0mm x 3.0mm x 1.86pm Contact size : 0.3mm x 0.3mm Sample 1 Isolated microcrystal with no visible defects. (microcrystal) Ohmic contacts. 8102 substrate. Diameter : ~ 4 mm , Height : ~ 2 pm Sample 2 Isolated microcrystal with a twin defect. (microcrystal) Non-Ohmic contacts. SiOz substrate. Diameter : ~ 4 um , Height : ~ 2 um 52 sample (b). Although no significant difference of the contacts was observed in the photos, it turned out that the contacts of one sample (a) were Ohmic where as the other contacts in (b) were non-Ohmic. Our method could be tested more generally for these two different samples whether it determines the conductivity, which is independent of the contact properties. The characteristics of all the samples in this work are listed in Table 2.9. All diamond samples were prepared by microwave plasma enhanced CVD at Kobe Steel USA, Inc. 2.4.2 four-probe measurement With four probes formed on the samples, the I-V characteristics were measured by DC voltage as a function of temperature in a vacuum level less than 1045 torr. To investigate the I-V characteristics of the contacts, a fixed amount of current was used for each current flow. All possible combinations of the voltage and current measurement generated a 6 by 6 resistance table that was described in Section 2.2.2. A total of 36 elements in the resistance table consist of six 2-terminal terms, six 4-terminal terms, and twenty-four 3-terminal terms. While these measurements were done through a broad temperature regime (-100 ~ 170° C) as in Figure 2.26, a complete measurement of a resistance table was done only for a specific temperature for each sample. At the other temperatures, only one 4-terminal resistance (R;4 = V14 / I 23 ) was measured. Since the geometrical factor is temperature independent, the conductivity at the other temperatures can be obtained by dividing the 4-point resistances with this geometrical factor. The investigation of the temperature dependence of the conductivity provides the activation 53 1000001 ' 3 F ' Y ' C ’ r ' ' 1 1 1 J o d 1 ° 3,, 3 ° 1 j <3, . MC-A (lavu) fl oo o MC-B (“by“) 10000 1 o 1 1 o 1 1 . “ 1 1000 -. g 1 l A . 4 G 4 4 x V g :1 O‘.’ 100 1 1 = i I 4 d J l l 10 1 "‘ 1 i 2 J 1 1 V I j ' fi' 1 V r fl T I I '..__. -150 -100 -50 0 50 100 150 200 T (°C) Figure 2.26 Temperature dependence of a resistance of diamond crystallites (Sample 1 (solid circles) and Sample 2 (open circles)). To investigate the temperature dependence of the resistivity of these samples, a four-terminal resistance (R;3 ) were measured over a wide range of temperatures. 54 energies of the doped semiconductors.28 The conduction mechanism of each sample can be understood and compared using these activation energies. The resistance measurements for some samples were done with two different current directions to determine the non-Ohmic contact resistances. Usually two diagonal resistances were measured for these two current directions; they could provide complete information of non-Ohmic contact resistances. In this submicron scale, the leads were electrically fragile because static discharges could happen near the contacts. The melting of metal leads that might cause the missing of an entire portion of the contacts sometimes happened during the measurement. So the current level should be kept below 10 11A to prevent the contact disconnection from the melting. With this problem, some measurements did not provide enough information (two complete sets of resistance table for two current flows) needed for the analysis. 2.5 Analysis 2.5.1 diamond film To test our method, we used two films with multi probes whose conductivity could be determined by the van der Pauw method. One (Film 1) had only four leads on the film and the other (Film 2) had six leads. With the Film 1 with four contact pads of Figure 2.24(b), we measured all possible combinations of current and voltage measurement to construct a 6 by 6 resistance table of Table 2.10. It was given by constant current (1 (IA) to investigate Ohmic behaviors of contacts at T=24.7° C. For this sample, we measured two diagonal terms (two terminal measurements) for two different current 55 Table 2.10 Resistances measured for homoepitaxial film by 4-probe experiment (k9). R VI2 V13 Vl4 V23 V24 V34 I12 264.6(329.5) 106.65 90.95 -158. 17 -173.94 -_l_5_.'_72 I13 107.41 l98.7(l98.7) 105.988 91.239 1.43 -92.658 I14 91.62 106.097 l84.5(184.5) M 92.636 78.158 I 23 -232.6 90.23 M 322.4(248.1) 247.3 -75.834 I 24 -246.7 1.2—12 91.391 246.5 337.7(265.1) 92.612 I34 ;_1_5i9_ 93.7 14 78.268 -77.86 94.170 l72.l(l72.l) Table 2.11 Geometrical factor table obtained by FEM (mm'l). F Vl2 V13 V14 V23 V24 V34 I12 904.04 515.40 393.80 -388.65 -510.24 -121.59 Il3 515.32 1023.48 506.32 508.16 M -517.16 114 393.80 506.27 947.54 _l_l_2._42 553.74 441.27 I 23 -388.68 508.13 M6 896.80 501.13 -395.67 124 -510.18 M 553.81 501.14 1063.99 562.85 I 34 M -517.22 441.30 -395 .68 562.84 958.52 Table 2.12 The resistivity and contact resistances of diamond film (Film 1) given by van der Pauw formula (V DP) and our method. P (9 cm) P (52 cm) 71 . Ar 1 (m) 72 . Arz (kg) 7'3 . A73 (k9) 7.. . Ar4 (kn) (VDP) 12.51 12.91 37.8, -0.9 139.8, 34.1 24.55, -1.45 19.95, -l.35 56 directions to identify all non—Ohmic contact resistances. Notice that some of the_matrix terms showed substantial asymmetry indicating that some contacts were non-Ohmic. However, the 4-terminal measurements (underlined) showed a relatively good symmetry. We also did the FEM analysis using ABAQUS to find out the geometrical factor table in Table 2.11. From the 36 elements in this table, we used only the 4-terminal terms to determine the resistivity of this film that would be compared with the same quantity calculated from the van der Pauw method. The contact resistances were obtained by fitting the diagonal elements in both tables. They turned out substantially non-Ohmic as anticipated from the asymmetry of the resistance table. The results from the van der Pauw and our method are presented in Table 2.12. The resistivity given by van der Pauw method was 12.51 (Q cm) and the resistivity from our method was 12.91 (0 cm) which agrees within 3% error. Thus, the fitted resistivity from our method agrees well with the resistivity from the van der Pauw formula. Another test has been done on Film 2 that had six contact pads. At this time, I obtained two complete resistance tables for the different current directions as shown in Table 2.13 and Table 2.14. The minus signs in Table 2.14 came from the definition of the resistance. Table 2.13 and Table 2.14 were given by constant currents (100 nA) at T=22.8° C. These tables show a good symmetry in each term that indicates that the contacts are Ohmic. The geometrical factors of the film were given by the numerical simulation and shown in Table 2.15. All six pads were constructed on the film as perfect conductors, although two pads were not used in the measurement. From these geometrical factors and the resistance tables, the conductivity of the film could be determined by the van der Pauw method and our method. By the van der Pauw formula, 57 Table 2.13 Resistances measured by 4-probe experiment (k9). R V. V. V... V.. V. V... I12 149.20 76.30 53.51 -70.91 -91.58 M I ,3 76.14 162.20 66.30 83.66 fl -93.36 I ,4 55.23 66.07 141.10 _10_.9_8_ 83.69 72.65 I 23 -70.40 83.03 M 156.80 81.17 -72.20 I 24 -90.63 fl 83.1 1 80.85 177.80 93.12 134 M -92.50 72.08 -72.00 92.53 168.60 Table 2.14 Another resistance table for the opposite current flows of Table 13. (k9) R V12 VI3 V14 V23 V24 V34 I21 -l49.00 -76.06 -53.50 71.03 91.73 20.20 I31 -75.89 -l62.00 -66.06 -83.66 23 93.45 I 4, -55.04 -65.86 -141.00 M -83.76 -72.77 132 70.30 -83.09 M -156.70 -81.07 72.24 I 42 90.46 _9._9_2_ -83.23 -80.78 -l77.80 -93.22 I 43 29$ 92.42 -72.28 71.96 -92.64 -168.70 Table 2.15 Geometrical factors calculated from FEM (mm'l). l" VI2 Vis V14 V23 V24 V34 I ,2 712.19 408.59 262.44 -303.61 —449.75 -146. 14 I 3 408.63 878.20 350.58 469.57 _-__5__8_._(_)_’_5_ -527.62 I 4 262.47 350.58 779.07 M 516.60 428.49 I 23 -303.57 469.67 M 773.24 391.65 -381.59 124 -449.70 £807 516.57 391.63 966.27 574.64 I 34 -146. 19 -527.69 428.44 -381.50 574.64 956.13 Table 2.16 The resistivity and contact resistances of Film 2 given by van der Pauw formula (VDP) and our method. p (9 cm) p ((2 cm) 7', , Ar; (k9) 72 , Arz (k9) F3 , Ar3 (kfl) F4 , Ar4 (kfl) (VDP) 12.62 I 13.25 17.5, 0.05 27.35, 0.05 18.15, 0.05 11.65, 0.05 58 the resistivity p was given by 12.62 (9 cm). We used only two 4-terminal resistances (R324 , R1243 ) in the formula because the other term R1234 was very unstable due to the symmetric formation of the contact pads. And the same resistivity as well as the contact resistances were obtained by our method and compared with the result from the van der Pauw method in Table 2.16. The same 4-terminal geometrical factors (R13;1 , R1243 ) used in the van der Pauw method were used to extract another resistivity 13.25 (Q cm) by our method. It agreed with the van der Pauw result (12.62 (9 cm)) within 5% error. All of the four contact resistances in the same table show good Ohmic behaviors as expected from measured tables. Our technique works well with a two dimensional sample. It was verified by the comparison of the result from the van der Pauw method. Therefore, we suggest that it can be applied to the 3d sample, too. One of the advantages of our method is that it could determine the contact resistances besides the resistivity of a sample. The detailed fitting procedure to select data set and fitting parameters will be mentioned in next section for the analysis of crystallites. Another test simulation was done to check how the result was changed depending on the positions of leads. When one of the leads was moved by -0.]mm in x-direction Table 2.17 Stability test of 4-terminal resistances on the position of one contact. 34 24 23 14 13 12 R12 R13 R14 R23 R24 R34 Before (k0) -121.59 -9.007 1 12.47 1 12.46 -9.044 -121.54 After (k9) — 124.84 -13.06 1 11.79 1 11.79 -13.06 -124.84 Error (%) 2.7 44.4 0.6 0.6 44.4 2.7 59 (sample size is about 3x3 mmz), six terms of 4-terminal method were shifted from the initial values as in Table 2.17. Two of these terms (R1234 , R53) given by the crossed formations of voltage and current measurements showed the significant changes up to 44.4% by the shifting of one lead. However, the other terms turned out stable. From this result, it has been realized that the position of the contacts should be reconstructed accurately for the FEM especially for the symmetric formation. 2.5.2 sample 1 (Ohmic contacts) As an illustration of this technique on 3d samples, we used two diamond crystallites with four terminals (Figure 2.25). A resistance matrix for Sample 1 (Table 2.18) was completed by making all 36 resistance measurements. Diagonal terms in boldface denote 2-terminal measurements and the underlined values are 4-terminal measurements. A 6 x 6 matrix of geometrical factors is obtained by using the FEM and shown in Table 2.19. Diagonal terms in boldface denote 2-terminal measurements and the underlined values are 4-terminal measurements. Within the experimental error, Table 2.18 is symmetric which indicates that r2 and r3 are Ohmic. If the contact resistances are Ohmic, we can determine the resistivity p and the four contact resistances (I; = r, '= T; , i = l,..,4 ). As a check of the validity of our method, we first calculated the resistivity from the 4- terminal measurements (where R5” = pI‘é’" ) with a linear fit through all six data points and the origin. We then used this p to determine the contact resistances from the 3- terrninal measurements (each of which involves only one contact resistance) and then 60 Table 2.18 Resistances obtained from the experimental measurement for Sample 1 (k9). R V. V. V. V. g V. V. I ,2 720.0 560.0 508.0 -176.0 -231.8 :55_._5_ I 13 568.7 1039.0 534.5 497.3 43$ -531.1 I l 4 518.4 540.2 986.0 M 500.0 476.9 I 23 - 174.5 498.7 M 665.0 195.1 -477.7 I 24 -230.6 :35._2 498.5 195.4 718.0 531.0 I 34 £7 -534.2 473.7 -477.6 529.2 999.0 Table 2.19 Geometrical factors from the finite element method for Sample 1(|.I.m'l ). r V. V. V. V. V. V. I12 1.6609 0.9635 0.7955 -0.6974 -0.8653 M72 I 13 0.9634 1.9550 0.9568 0.9916 -0.006647 -0.9982 I , 4 0.7957 0.9569 1.5608 1.161; 0.7651 0.6039 I 23 -0.6973 0.9916 Q._1_6_1_3_ 1.6889 0.8586 -0.8303 124 -0.8652 -0.006684 0.7651 0.8585 1.6303 0.7718 I 34 M -0.9982 0.6038 -0.8303 0.7717 1.6021 Table 2.20 Resistivity and contact resistances for Sample 1, assuming that all the contact resistances were Ohmic. p (Q cm) rl (k0) r2 (k9) r3 (k9) r4 (k9) (a) 23.72 316.3 6.1 276.2 329.0 (b) 22.50 314.0 15.0 285.0 336.0 (c) 23.72 303.3 5.6 274.0 329.0 (d) 23.58 317.6 7.3 277.5 330.0 61 averaged the results. The results are shown in row (a) of Table 2.20. I then did a least squares fit for five parameters to the six 2-terminal measurements. The results are shown in row (b). In (c), the resistivity was fitted by 4-terminal measurement as in (a), and four contact resistances were obtained from six diagonal terms by a least squares fit. Finally, we fitted five parameters with all 36 elements of the resistance matrix, the results of which are shown in row ((1) of Table 2.20. It is clear that all four methods give essentially the same results. Note that one of the contacts has a very small resistance compared to the others. 2.5.3 sample 2 (non-Ohmic contacts) The measured resistance matrix for Sample 2 is given in Table 2.21. All measurements were done at constant current (100 nA) at room temperature ('1‘: 20° C). The values in parentheses in the diagonal terms were measured for a reversed current flow. The different magnitudes in these two measurements show the non-Ohmic behavior of the contacts. Diagonal terms in boldface denote 2-terminal measurements and the underlined values are 4-terminal measurements. Using Table 2.5, it is clear from the asymmetries that contact resistance 3 was very non-Ohmic, and that contact resistance 2 had a small non-Ohmic part. As discussed in the previous section, a second set of measurements had to be taken, with the current probes reversed. This was only done for the six diagonal (2-terminal) elements before the leads were damaged. Nevertheless, this is a sufficient set of data to determine the resistivity and all the contact resistances. The geometrical factors are given for the Sample 2 as in Table 2.22. We processed the data for Sample 2 in four distinct ways to test the accuracy of the fitting procedure. 62 In the first method we first calculated the resistivity from the 4-terminal measurements and with this p determined six of the eight contact resistances from the 3-terminal measurements, and the remaining two contact resistances (r,' and r4 ) from the diagonal elements with the currents reversed. The results of this analysis are shown in row (a) of Table 2.23. In the second method we did a least squares fit to obtain the resistivity and the Ohmic part of the contact resistances (7,, i = l,..,4 ), from the six diagonal elements of Im a. , and the 3—terminal elements of the original if" . From the six diagonal elements of AR resistance matrix that involve both r2 and rz', i.e. the elements (R1223 , R1224 , R; , R3 ), we were able to fit the non—Ohmic part of the four contact resistances (Ar, , i=1,..,4). The results are shown in row (b) of Table 2.23. There is rather good agreement between the two methods, with only a 10% difference in the resistivity. This agreement obtains in spite of the very large and non-Ohmic contact resistance r3 that dominates the least squares fitting procedure for the diagonal elements. In general, it is probably best to determine the resistivity from the four terminal measurements, and so as a final check, we used the value of p determined from the 4-terminal measurements. And a least squares fit was done to obtain the Ohmic part of the contact resistances ( 7} , i: l,..,4 ), from the six diagonal elements of El” . The non-Ohmic parts of the contact resistance are unchanged by this alternative method of determining the resistivity. These results are shown in row (0) of Table 2.23. Finally, the row (d) of Table 2.23 was given by fitting all parameters by whole table. 63 Table 2.21 Resistances obtained from the experimental measurement for Sample 2 (kn). R V12 V13 V14 V23 V24 V34 I12 875(875) 386 369 -432.3 -451 -_1_8,_1_ I13 392 3771(4878) 587 3240 _2_0§ -3032 I14 369.5 389 1591(1591) 21—2 1114 917 I 23 -450 3255 2_2’_1 3774(4936) 663 -3026 I 24 -471 £2 1126 654 1705(1705) 943 I 34 1041 -4207 918.9 -4190 935 5236(4098) Table 2.22 Geometrical factors from the finite element method for Sample 2 (}.tm'l ). r V. V. V. V. V. V. I ,2 1.0825 0.6336 0.6049 -0.4489 -0.4777 -0.02869 I13 0.6336 1.4178 0.9440 0.7843 QQLOA -0.4737 114 0.6049 0.9440 1.4112 _Q._3§2_1_ 0.8064 0.4671 I 23 -0.4489 0.7842 9,1321 1.2332 0.7880 -0.4450 I z4 —0.4776 _0_.3;l_(_)4 0.8064 0.7880 1.2840 0.4958 I 34 @2862 -0.4738 0.4673 -0.4452 0.4960 0.9407 Table 2.23 Resistivity and contact resistances for Sample 2. 10(5) cm) 7., Ar. (k9) 7.. Ar. (k9) 7.. Ar. (k9) 7.. Ar. (k0) (a) 62.68 -3.0 , -7.00 162.6 , 10.7 3379.6 , 600.7 675.5 , 51.3 (b) 69.08 -26.8 , 11.6 152.9 , 4.72 3361.7 , 575.9 654.4 , 7.70 (c) 62.68 19.8 , 11.6 189.5 , 4.72 3398.1 , 575.9 692.2 , 7.70 (d) 60.78 9.30 , -7.50 173.1 , 12.5 3390.5 , 600.9 687.0 , 52.0 In this analysis, it should be noted that there are some possibilities of error in modeling and fitting as well as experimental measurements. First, we suspect the effective contact area in the sample is less than that apparent in the SEM photographs. Some part of the contact might not form a good electrical contact with the sample, and hence decreases the real contact area. The sensitivity of diagonal and 4-terminal terms has been tested by calculating the resistance changes by shrinking the area of all the contacts by 1/3. The 2-terminal measurements varies 30~40 % but the 4-terminal ones were changed by less than 10%. The resistivity fitted by 4-terminal elements turned out more stable than the contact resistances included in 2-terminal terms under this change of the contact geometry. Hence the resistivity should be fitted from the 4-terminal resistance measurements, which are contact independent resistances, and the contacts are then obtained subsequently by fitting the whole resistance table. We note that a fine meshing is necessary for reliable results for the geometrical factors for the 2-terminal measurements, but a coarser meshing is sufficient to get reliable geometric factors for the 4-terminal measurements. And we could get better results by doing the measurements on many different samples that have the same resistivity and with many contacts that give more terms for consistency checks. Throughout our theoretical treatment, although we have taken into account the spatial distribution of currents within the sample, there has been no attempt to consider the charge redistribution at surfaces and interfaces, for example due to band bending. Contact resistances, in particular, will depend on local electric fields which, in turn, will; depend on details of the semiconductor-metal interface. In retrospect, it is somewhat surprising that a model invoking local contact resistances should work so well, with 65 contact pad dimensions and separations approaching a space charge depth. If the scale of the experiments were to shrink further, these considerations will need to be treated with more rigor. Even if the reconstructed geometry is correct, one more error is possible. The conductivity of the sample was assumed to be isotropic due to the diamond lattice structure. So, the conductivity has been treated as a scalar, not a tensor. However, this assumption may not be true for a sample with a twin boundary that could be observed in Sample 2. This twin boundary may affect the isotropy of conductivity or homogeneity of the material property. Nevertheless the reciprocal theorem is still true for anisotropic conductivity; a resistance table is still symmetric for anisotropic tensor. We did not analyze this effect on Sample 2 when the conductivity was determined in this chapter since the defect is not apparent to be considered in the SEM photo. The temperature dependence of conductivity has been one of main concerns because it is crucial to understand the conduction mechanism of the doped semiconductors. The temperature dependence of the resistivity in Figure 2.27 was obtained from the temperature dependence of a 4-terrninal resistance in Figure 2.26. It was done by rescaling the resistances with a geometrical factor for the measurement. The Table 2.24 Fit result of conductivity model with two activation energies for data in Figure 2.27.29 Sample a] E] 0', E2 (102 o" cm") (eV) (102 :2" cm") (eV) Sample 1 1 14: 4 0.347 :0.001 1711.9 :345 0.109 :0.004 Sample 2 163: 5 0.351 :0.001 21.8: 17 0.059 :0.014 Polycrystalline film 0.95 :0.12 0.199: 0.004 102: 6 0.0089 :0.009 66 100000 I ' l r l v 1 1 1 I I l I ' I d j . HF1 1 . a HF2 ‘ ' 0 91:1 ' ‘ . o ‘ 10000 -. ° PF2 ' . E o MC-A 5 : o uc-a - : d ‘ I 1000 -: 1 a . = . 1 al 1 A (a). 100 1 ’ 1‘ g I 1 . . g 1 1 o. 2 I ' cl ‘ .1 I ‘ . 1o ‘5 I, A -: Z . r' A : . . y' A . ul $~ g. 4 1 .3 A ‘ 47° " ‘ 1 1 ‘ 1 -I a A d : _ an a 001 I l I l V l I ' I ' I r I I I’ 2 0 2.5 3 0 3.5 4.0 ‘ 4.5 5.0 5.5 6.0 -1 1000/T (K ) Figure 2.27 Temperature dependence of the resistivities of the diamond samples. Two microcrystallites (MC-A, MC-B) correspond to Sample 1 and Sample 2. PF 1 and PF2 are polycrystalline films. HF] and HF2 are homoepitaxial films. The resistivity of these samples was obtained by rescaling the resistance measurement in Figure 2.26 using the fitted resistivity. 67 geometrical factor for the 4-terminal measurement is a constant throughout whole temperature regime. The temperature dependence of the conductivity is governed by a = 0, exp(— E, /kT)+ 0, exp(— E, /kT), (2.37) where E is the impurity ionization energy and E2 is from the nearest neighbor hopping. 0'l , 0'2 , El and E2 were obtained by fitting the data with this relation. I present the fitted results given by J aeger in Table 2.24.29 It was observed that the activation energy E1 was the same for two diamond crystallites, but the polycrystalline film presented significantly different activation energy. That indicates that the conduction mechanism in the polycrystalline film is quite different from the homoepitaxial film or microcrystallites. The discrepancy might be from the effect of grain boundaries in the film as mentioned in the motivation of this work. No significant structural defects such as grain boundaries are formed in a homoepitaxial film since it is grown on the diamond substrate. 2.6 Conclusion A method to measure the resistivity and contact resistances of single crystals in complex geometry has been introduced and demonstrated on micron-sized diamond crystallites. The method is quite general, if the material of the sample is homogeneous and Ohmic, with contacts that can be non-Ohmic but should be equipotential surfaces. The sample resistivity and contact resistances were obtained experimentally using 4- probe measurements, aided by finite element calculations. This technique can be applied to determine the sample resistivity using any shape of sample. It is possible to determine 68 the sample resistivity and the Ohmic part of the contact resistances solely from the set of 2-terminal measurements, with currents in both directions, but it is probably best to use the 4-terminal measurements to determine the resistivity. The most accurate results will be obtained from a complete set of resistance measurements with currents in both directions. V_L' This technique was tested to determine the conductivity of some materials in complicated geometry like CVD diamond crystallites, but it should be noted that there are 3. some restrictions on the application of this method. For a material that has an anisotropic conductivity, our method cannot be applied. There are six terms in a general conductivity tensor because of its symmetry. In our method described in this chapter, the conductivity has been treated as a scalar, not a tensor. Therefore, we need a different approach for the anisotropic case. The next chapter will be devoted to a presentation of a method to determine the anisotropic tensor using the iterative linearization technique as well as the multi probe measurement. 69 Chapter 3 ANISOTROPIC CONDUCTIVITY MEASUREMENT FOR COMPLEX GEOMETRY 3.1 Introduction In this chapter, I introduce a method to determine the anisotropic conductivity of an arbitrary shaped sample. The conductivity of our samples (CVD diamond crystallites) was assumed isotropic throughout the previous chapter due to the symmetric lattice structure of the samples.”31 However, one of the crystallites had a clear twin boundary between the contact pads (see Figure 3.1). The homogeneity may not be satisfied in this sample because of this defect, that is a main requirement for the application of our method. Under the assumption that the effect of the defect could be neglected, its contribution to the transport has not been considered rigorously before. However, this inhomogeneity of the sample induced by some significant defects Figure 3.1 A diamond crystallite has a local defect (twin boundary) denoted by an arrow. This defect was neglected in the isotropic conductivity determination. 7O should be considered more carefully in the determination of the material properties. Moreover, some materials (Bi, Sn) and some superconductors are known to have anisotropic conductivity tensors from the anisotropic lattice structures (see Table 3.1). Diamond and Aluminum have an isotropic conductivity tensor from the cubic lattice structures, but some materials in other lattice structures (tetragonal, trigonal, and hexagonal) usually have anisotropic conductivity tensors. Therefore, the conductivity '1" should be determined as a tensor form that has six terms in 3d. Only three diagonal terms can be determined when the three principal axes are known. The main difference between the isotropic and anisotropic case is related to the geometrical factor. For an anisotropic conductivity tensor, the resistances can not be represented by the simple form of a geometrical factor times conductivity. In fact, the geometrical factor cannot be defined in the anisotropic case. Nevertheless, it may be possible to calculate the anisotropic conductivity tensor for some simple shapes (brick, cylinder) that build up uniform current patterns. However, it is not easy to fabricate the samples into such shapes in micron scale, and the principal axes of conductivity are generally unknown. To identify this conductivity tensor, I developed an algorithm using Table 3.1 Electrical resistivity of metalic crystals.32 Values of principal resistivities at T=20° c. (in unit 10'6 :2 cm) Crystal System pl , p2 p3 Aluminum Cubic 2.72 2.72 Tin (Sn) Tetragonal 9.9 14.3 Bismuth (Bi) Trigonal 109.0 138.0 Zinc Hexagonal 5.91 6.13 71 the multi-probe measurement and computer simulations (the FEM analysis and the iterative linearization technique). This method has been tested for the 2d and 3d computer models and a real sample (Bi) whose anisotropic tensor components are already known as in Table 3.1. In the next section, a brief description of the nonlinear problem induced by anisotropic conductivity is presented and I will describe the basic idea of a method based on iterative linearization in Section 3.2.2. The orthogonal transformation is introduced to find the principal axes of a tensor in Section 3.2.3. In Section 3.3, I introduce a general scheme of computer simulation using FEM on the computer models (Section 3.3.1) and the interfaces between the FEM package and the minimization routine (Section 3.3.2). I will explain how to apply this method to real material (Bi) in Section 3.4. The sample geometry and the lead formations will be described in that part. The results of the computer models and the real sample are presented and analyzed in Section 3.5.1 ~ 3.5.3. The stability test on our method is discussed in Section 3.5.4. To close this chapter, I will provide the conclusion and suggestions in Section 3.6. 3.2 Theory 3.2.1 anisotropic conductivity tensor For an isotropic resistivity tensor, a sample resistance ’R;."' has been defined by (3.1) i] ’ 3R3?" = 1".” Where 1‘5" is a geometrical factor that depends only on the geometry and the resistivity p 18 Single parameter. The geometrical factor does not have any orientation dependence 72 since the sample is isotropic. This simple relation in Eq. (3.1) makes it possible to determine a resistivity by fitting the geometrical factors 1‘5?" and the sample resistances 5R3". However, the conductivity should be considered as a 3 x 3 tensor in general. This anisotropic behavior of the conductance could be observed in many materials. The conductivity tensor is symmetric when there is no external magnetic field.33 Then, the number of the independent terms in the tensor is given by d (d + l)/ 2 in d—dimensions. It becomes three in 2d and six in 3d as shown in the following equations. on a , , 0' =[ x’ J in 2d (3.2) on, 0' 0,, 0",). on a: 0,, 0'”, a), in 3d (3.3) OX2 a}! all If the principal axes of a conductor are known and the coordinate axes in the simulation are set up equal to these principal axes, the conductivity tensor becomes a diagonalized tensor. Since all off-diagonal terms are set zeroes, the only unknown terms in a tensor are the diagonal terms. Even so we cannot use the previous method to determine the conductivity tensor because the geometrical factor 1".” cannot be defined as in Eq. (3.1) for the anisotropic tensor (5' ), i.e. R.’."' = -R.’"’(6) ¢ p17?" . (3.4) So, the resistivity p cannot be obtained by dividing a resistance by a geometrical factor. All elements in a conductivity tensor are correlated in the expression of the resistances. These elements cannot be separated from the geometrical factors as previously done for 73 the isotropic tensor. More general relations between the experimental measurements and the theoretical calculations should be ‘R.j-'"=‘R§?"(6)+n(5. —6,-,,.)+r,'(6,,,, —6,,). (3.5) where 'Rfjf" is an experimental measurement and r, and r,‘ represent non-Ohmic contact resistances. We need to extract the conductivity tensor using Eq. (3.5) aided by the multi probe measurement and the FEM analysis. In the presence of a magnetic field B, the tensor becomes antisymmetric and can be separated into a symmetric and an antisymmetric part as in Eq. (3.6). on on, 0 on on “also,2 0 o = 0",, a” 0 = on, -RZB0'02 0),, O 0 0 oz, 0 0 oz, 2 , (3-6) on on, O 0 R200 0 = on. 0,, 0 +3 —R,o,2 0 0 0 0 on 0 0 0 where RZ is the Hall coefficient and 0'0 is given by /2 0'0 = (03.0"... —ox}.2) . (3.7) However, this Hall measurement will not be considered in this work. 3.2.2 iterative linearization technique for nonlinear inverse problem The unknown conductivity tensor can be determined by fitting two resistances (experimental and theoretical) in Eq. (3.5). Since the functional forms of a resistance in terms of the tensor elements are generally unknown, we should use the iterative linearization method. While the tensor elements are changed, the linearized resistances 74 calculated from the FEM are fitted to the experimental measurements to extract the optimized tensor elements. Usually the optimized solution can be achieved after many iterations of the linearization and least square fittings. This technique is also known as the Gauss-Newton method.34 The term Gauss is named by the least-square fitting of the resistances and the term Newton comes from the iterative linearization technique in the optimization procedure. This technique has been widely used to solve nonlinear Optimization problems, for instance the earth conductivity problem in geophysics.35 Here I describe the detailed procedures of this technique. Suppose we are trying to find an anisotropic conductivity tensor with unknown principal axes. Simply we choose an arbitrary tensor to start the iteration, which is defined by six parameters. To get the linearized form of each resistance for this tensor, all first derivatives of the resistances with respect to the six tensor elements are calculated using the FEM. Then, the expressions of the resistances are known as linearized forms, we can perform the least square fitting to extract a tensor. However, since the linearized forms are correct only near the previous tensor, the fitted tensor may not be the global solution of the optimization. Therefore, the fitted tensor substitutes for the old tensor and the same procedures are done. This iteration will go on until the best-optimized tensor is obtained. After the tensor is obtained, it is diagonalized by the orthogonal transformation to find the principal axes and values of the tensor. In this iteration, the first step is very important. The iteration begins from an arbitrary selected point that might be far from the global solution. Then it is very crucial to find a next point close to the global solution in the first step. We begin the first step with an isotropic tensor (unit conductivity) and keep the tensor isotropic throughout the 75 p‘ p'+Ap p" p2 p°p°+Ap Figure 3.2 Iterative linearization technique of 12 minimization in 1d (Newton method). This technique is useful when the function form of the 12 is not known. Each step, the function form is approximated to a linearized form by Taylor expansion. After many iterations, it reaches the minimum point. 76 step. This procedure is exactly the same as our method in the previous chapter. We can determine the scale factor po that is nothing but an isotropic conductivity. When a tensor is isotropic, there is only one parameter p0 ( = p” = p),y = pa ). Since the conductivity is isotropic in this step, we can use the relation of R = pOFO , (3.8) where F0 is a geometrical factor given by the initial tensor that is a unit conductivity tensor. The fitted tensor that will be used for the next step has same diagonal terms of p0 as p0 O O p°= O p° 0 . (3.9) O 0 p° From the second step, we use the linear approximation method of the resistances. Each tensor element is treated separately in the procedure. A resistance depending on the six fitting parameters can be represented by RU)”,p).).,pzz,pn,pyzipxz)=R0032,pg)»pgrpgnpgz’pgz)+2Aleprj ’ (3°10) i< j where R0 is a resistance determined by the resistivity tensor p0 given by a previous step. The linear expansion of the resistances can be defined by (3.11) R 9+A .. —R .9 pij=p3+Apij , Al}: A5— 2 (p0 p") (p0). Apij Apr} Selecting Apij is somewhat arbitrary depending on the functional shape around the tensor p3. The constant Ar; can be given by taking the numerical derivative of the resistance. 77 Then the resistances in Eq. (3.10) can be fitted with the experimental values to find a conductivity tensor that minimizes the 12 of the resistances. By continuing this process until the best optimum point is achieved, the anisotropic conductivity tensor and contacts can be given. This is the main idea of this algorithm. Next, I explain the way to save one fitting procedure in the first step. Each iteration in this simulation requires a heavy computer job; sometimes it is very efficient to skip one iteration. Previously, I consider only an isotropic tensor in the first step for the rescaling of the resistivity. However, an anisotropic tensor also can be used for the rescaling and the determination of each tensor term simultaneously in the first step. First, I will describe the skip for a diagonalized tensor. It will be explained for a general tensor later. Suppose we have a diagonalized tensor. Then, we have only three unknown variables in a tensor. A resistance can be represented by a geometrical factor F0 and some constants Bi}. as in Eq. (3.12). u + W + :2 R(pxx’pyy’pzz)=r0[p p3 p +Bupu +Bwp”, +Bapa] . (3.12) Since a resistance R should be equal to F0 for the unit tensor ( p“ = p”, = pZZ = 1.0 ), a relation between three coefficient B”. can be found by BU+BW+Ba=O. (3.13) Then Eq. (3.12) can be simplified as R(p...p.,..p.) = 131(1)) +3....(p... -p..)+B.(p. -p..)l . (3-14) where 78 p.+p.+p.

= " - 3 (3.15) One coefficient Bu has been removed from Eq. (3. 12) using Eq. (3.13). If we define new parameters of 1,]. and Ba by py‘pu AR 1 x.~=——— ,B,.=r —-, (3.16) J (p) } ()[Apu'] 3 then we have a relation between a resistance and the fitting parameters (p) and Zr;- R(pxx’ pyy’ pzz) = I-‘0> 0'0 ). Two inclusions are located in a constant electric field Eo formed by a voltage applied on the boundaries of the host. The voltage between the inclusions is calculated for this geometry. The initial voltage before the formation of the inclusions is given by EOL. However, if two circular conductors are implanted in this host, they deform the current paths in the region near the inclusions. Then, a voltage change AV from the initial value is induced between the two centers of the inclusions. 4.3.1.1 Exact solutions in 2d Djordjevic et a1. solved this problem for perfect conductor inclusions in 2d using the multiple image charge method.45 The solution is given in closed form by 114 L E0 a Figure 4.3 4-point resistance measurement of two circular inclusions. The voltage between two inclusions is calculated in terms of the geometrical parameters when a constant electric field is applied. AV = on/LZ --4a2 = EM/(w+2a)2 —4a2 = E0 w(w+4a) , (4.3) where L = w+ 2a is the distance between two centers, a is the radius of the circular inclusions. The asymptotic forms of this solution can be checked simply. AV approaches EOL as L goes to infinity. No voltage difference is measured (AV = 0) when two inclusions touch (L = 2a). Besides this induced voltage AV , we should have a current to define a resistance for this configuration. Thus, a normalized current I0 has been defined by total current flow into the cross section of the inclusions in the direction of E0 (see Figure 4.4). The current density J 0 in the host is given by (JOE, from Ohm’s law. The cross section of the inclusion is given by 2a in 2d. Therefore, the normalized current I 0 is given by 2a0'0E0. Thus, from the given AV and the new current 10, a resistance R4 can be defined by R. = — . (4.4) 115 2a Figure 4.4 Normalized current I 0 is defined by the total current flowing through the cross section of the inclusions. This resistance is called a 4-point resistance because it is equivalent to a resistance measured from the 4-point measurement. The 4-point resistance R4 can be given using the closed form of AV in Eq. (4.3) and the normalized current 10. 4 10 2116050 -200 Z a R _AV_E0‘/W(w+4a) _ l w(w+4] (45) The asymptotic forms in two limits are given by R4z-l- K , w/a<<1 (4.6) 0'0 lie 1 w R4 =—(—+2] , w/a>>1. (4.7) 200 (1 4.3.1.2 Empirical approximation and asymptotic solutions in 3d Before discussing the 3d composite, let us consider the 1d composite that has two perfect linear conductors as in Figure 4.5. The current density between the inclusions are 116 Figure 4.5 One dimensional composite material with two perfect conductor inclusions. identical for the two resistance measurements (R4 , R2 ). Since the voltage AV between the inclusions is simply given by Eow in the constant electric field, the 4-point resistance R4 can be represented by R, =33: EOW =31 . (4.8) IO OOEO o.0 Let us move to the 3d composite structure. In 3d, the inclusions are spheres. Thorpe suggested an empirical approximation of the voltage AV between the inclusions.53 l d 274 AV = EOL[l—(ZL£) ] , (4.9) where d is the dimension. This formula reproduces correctly the exact solutions in 1d and 2d. AV=EO[L—2a]=Eow , d=l (4.10) AV=EO\/L2--4a2 , d=2 (4.11) In 3d (d = 3), the approximation gives AV = EOL"“(L3 —8a3)”“ . (4.12) 117 In addition, the normalized current I0 defined in Section 4.3.1 is given by Irazcr'oE0 in 3d because the cross section of the spheres is 71212 . Then, the 4-point resistance R4 in 3d is obtained by 1/4 3_ 31/4 “4 3 1/4 R4=AV=E°L (f 8“) z 1 3+2 1+2 —8 . (4.13) 10 no COED trooa a a Meanwhile, the asymptotic solution of the same composite in 3d was given in the close neck limit (w/ a <<1).46 That was done by Choy et a1. using the multipole image method. Following this method, the voltage AV in that limit is obtained as a logarithmic function. 2 -1 AV 4 ” “E0 , w/a «1 (4.14) a ln{—)+ const w A constant term exists in the formula as the next leading term. Then, the 4-point resistance is represented by —1 AV 7‘ , w/a<>1. (4.21) ...— rroo a One of these asymptotic formulas (Eq. (4.20)) can be obtained more simply using the approximation that all currents flow through the neck. It is presented in Appendix A.3. 4.3.2.2 Exact solutions in 1d and 3d In 1d, the 2-point resistance (R2) is simply given by R2 = —, (4.22) where w is the neck distance. This resistance (R2) is equal to the 4-point resistance (R4) in Eq. (4.8). In 3d, this 2-point resistance can be obtained by the image charge method.52 -1 1 e °° 1 R =———= 27rd sinh -————— , 4.23 2 C00 00 (misinhmfi) ( ) n=l 120 where cosh(,B) 2 2i +1 . The capacitance C between two perfect spherical conductors is a 1 l C: 2 h Rea sin ””2 :l[slinh( 2n - l)[3 +sinh( Znfi {I (4.24) 1 l _2 h =2 1 7128618111 (H)I;— =lsinh(nl3) ”8% + sinh(2[3) + sinh(3fi) + Meanwhile, the exact asymptotic expansion in the limit has been done by Choy.46 It is obtained by —1 R2 = 1 [ln[£]+ const] , w/a <<1. (4.25) 4.3.3 The ratio of R4 and R2 The ratio of the 4-point resistance and 2-point resistance can be given by the exact form in 2d and asymptotic form in 3d. In 1d, two resistances turned out identical from Eq. (4.8) and Eq. (4.22). So, the ratio in 1d is 1. In 2d, two resistances were given by the exact forms. It should be noted that the two resistances (see Eq. (4.6) and Eq. (4.20)) have the identical forms of square root in the limit of w/ a <1 and at the upper end if d < 3 , so that in general for 1 < d < 3, we have the result and—3341) 3-d ' R“1 = 0'0 (A.12) (war) 2 This gives a result in two dimensions as 141 R"l =007Na/w (A.13) Note that as d approaches one from above, R‘1 = 0', / a) as expected, and as d approaches three form below, we have a divergence. If we use the closed form in 2d, R—I=O'0J’xmax yldx :0 Jam,“ cosBdG (A.14) 0 w+2a(1-c089) 0 (l+x)—cosB Then we have 9m... (1 1 2 —1 20 +12) arctan ( +1) ° 1.311% ,1 _ 2 (1+1) 1 0 (A.15) 2(l+x) arctan (1+1) 200(1+x) —6max + (/(l+x)2 —1 2C In the limit 1 = w/ 2a <<1, we have the same result with Eq. (A. 13). 2 73 6m} ,_ R"1 z 00['9max +—arctan{———~tan = 0'07: 1 (A.16) 71' 727 72 T ““74 w A more close examination of the integral when d=3, shows that if we use xmax = a for the R"1=oo(1+x) —0+ I upper limit, which seems reasonable, we can do the integral in Eq. (A9) in closed form, to give R—1_O. Jxmax szdx _750'0 xmax xdx — 0 — 0 w+2a(l-cos6) a 0 (l+x)—cos0 =7“, (1+X)zajgmu cosGsin 9d9 0 0 (l+x)—cosO (A. 17) Let y = cos6 , then 142 0 J1 (1+x)-y =4000+x)2al—y—(1+x)1n{(1+x)-y}”I“: =7t'0'0 (1+Z)Za[(ymax _1)+(l+x)ln{(1+X)x_ Ymax }] == trooa[(ymax — 1) + 1n{1—_—y—m-9-’-‘-}] Z (A.18) If we take ymax = 0 (0 :g)’ then R" z naoa[1n{i}—1]= naoa|:ln{2—a} — 1] = nooa[ln{—a—} + 1n{2}— 1] 7‘ W W (A.19) = moa[1n{3} — 0.3069] W And if ym = =0.7071 (9=%,xm=a), then 1 72 0.2929 x R" =—. trooa[- 0.2929+ ln{ = naoa[1n{3—} —O.8277] W The exact asymptotic expansion done by Choy gives R‘1 z 00a7r[ln(£]— E] z 00afl|:ln[£]— 2.667] . 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