An investigation of aging kinetics and creep deformation in composite solders with in-situ particulate reinforcements

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Choi, Sunglak

Date: 1997

Subjects: Deformations (Mechanics)
Metals--Creep
Solder and soldering

Program of Study: Materials Science and Mechanics

Degree Level: Masters

Language: English

Pages: x, 128 pages

Permalink: https://doi.org/doi:10.25335/cxp0-hv93