An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: McDougall, Jeffrey Lee

Date Published: 1998

Subjects: Metals--Creep
Solder and soldering
Thermal stresses

Program of Study: Materials Science and Mechanics

Degree Level: Masters

Language: English

Pages: xiii, 160 pages

Permalink: https://doi.org/doi:10.25335/e8zh-dt57

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