Studies on lead-free solders reinforced with mechanically-incorporated Cu, Ag, and Ni particles

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Guo, Fu

Date Published: 2002

Subjects: Copper--Creep
Metals--Thermomechanical properties
Nickel--Creep
Solder and soldering

Program of Study: Chemical Engineering and Materials Science

Degree Level: Doctoral

Language: English

Pages: xxi, 234 pages

Permalink: https://doi.org/doi:10.25335/9vc4-yh33

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