Characterization of microstructural evolution of crept, aged, and thermomechanically fatigued eutectic Sn-Ag solder joints using orientation imaging microscopy

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Telang, Adwait U. (Adwait Uday)

Date Published: 2002

Subjects: Dislocations in metals
Metallography
Silver
Solder and soldering
Tin

Program of Study: Chemical Engineering and Materials Science

Degree Level: Masters

Language: English

Pages: xv, 161 pages

Permalink: https://doi.org/doi:10.25335/1q24-k333

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