Roles of service parameters on the mechanical behavior of lead-free solder joints

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Rhee, Hongjoo

Date Published: 2005

Subjects: Electronic packaging--Materials
Solder and soldering

Program of Study: Chemical Engineering and Materials Science

Degree Level: Doctoral

Language: English

Pages: xx, 188 pages

Permalink: https://doi.org/doi:10.25335/aq3n-5b65

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