Characterization of deformation in Sn-Ag lead-free solders during thermomechanical fatigue using orientation imaging microscopy

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Telang, Adwait U. (Adwait Uday)

Date Published: 2004

Subjects: Dislocations in metals
Metals--Fatigue
Metals--Thermomechanical properties
Silver--Metallography
Solder and soldering

Program of Study: Chemical Engineering and Materials Science

Degree Level: Doctoral

Language: English

Pages: xxiv, 371 pages

Permalink: https://doi.org/doi:10.25335/mt6m-9f96

Full text