From the development of the first wireless communications systems, there has been growing demand for ever smaller, lighter weight, lower cost devices. Electronics packaging techniques have evolved with this demand, with a variety of process to create compact, high functional density systems. Recent developments in additive manufacturing technologies have enabled the application of low cost, rapid fabrication techniques to the development of radio frequency (RF) electronics. Using available direct-write technologies such as inkjet and aerosol jet printing, a wide range of electronic components, from RF devices to sensors and antennas, can be combined to form functional systems quickly and affordably. The purpose of this thesis is to investigate the application of a variety of additive manufacturing process to the packaging of radio frequency electronics operating into the mm-wave (30 GHz to 300 GHz) frequency range and beyond. Applications of aerosol jet printing for fabrication of passive circuit components operating in the THz frequency regime have been demonstrated, as well as limitations of this process, and potential improvements. A process for rapid prototyping of RF circuits operating in the X-band (8 GHz to 12 GHz), combining commercially available materials and packaged components, was developed. Wide-bandwidth printed interconnections to devices have been demonstrated, enabling the packaging of bare integrated circuits with very low loss, and low cost. Finally, a self-packaging process combining multiple additive manufacturing techniques is demonstrated for fabrication of a Ku-band (12 GHz - 18 GHz) transmitter. These packaging techniques pave the way for low cost fabrication of circuits and systems, while minimizing unwanted parasitic effects, enabling efficient operation beyond 100 GHz.
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