Analysis of slip transfer in TI-5AL-2.5SN (WT. %) at two temperatures in comparison to pure aluminum

Understanding the deformation mechanisms present near grain boundaries in polycrystalline hexagonal alloys will aid in improving modeling methods. Ti-5Al-2.5Sn samples were tensile tested at 296K and 728K, and slip behavior was assessed near grain boundaries. From the EBSD measurements of grain orientations, various metrics related to the slip systems, traces, residual Burgers vectors, and grain boundary misorientation were computed for boundaries showing evidence of slip transfer and boundaries showing no evidence of slip transfer. This work is compared to a similar study of an Aluminum oligo-crystal to aid in understanding the differences in slip behavior near grain boundaries in HCP and FCC crystal structures. Slip transfer in Ti525 was generally observed in less geometrically compatible conditions than Al, and slip transfer occurs at high misorientation angles in Ti-5Al-2.5Sn much more frequently than in Al.