This dissertation demonstrates a collection of strategies to package and heterogeneously integrate microwave and millimeter wave (mm-wave) electronics using additive manufacturing (AM). These strategies not only facilitate heterogeneous integration and higher functional density of a system-in-package (SiP)/system-on-package (SoP), but furthermore allow for structures and performance that is difficult or impossible to match with conventional manufacturing strategies. These strategies are implemented using aerosol jet printing, but may be applicable to other sorts of additive manufacturing technologies such as ink-jet printing. The processes developed in order to facilitate these procedures are described, including the use of multi-material aerosol jet printing (MMAJP) for the manufacture of composites and functionally graded materials for use in mm-wave circuits, and a chip-first approach to microwave and mm-wave circuit packaging. These processes enable the production of application specific SiP/SoP electronics for use in radar, communications, imaging, sensing, as well as the supporting circuitry such as filters and antennas which may be difficult or expensive to implement with semiconductor processes. Included are demonstrations of the integration of some of these strategies in complete packages. Characterization of materials used including conductors and dielectrics are presented, as well as simulations and measurements of package sub-components, and complete packages. Finally, the future of this research is discussed.
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