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Author: Wu, Yuelin
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Subject: Integrated circuits
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Subject: Microelectronic packaging
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Electronic Theses & Dissertations
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Theses
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English
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In Copyright
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Subject
Copper wire
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Copper--Corrosion
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Electrolytic corrosion
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Metals--Corrosion fatigue
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Reliability
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Research
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Wire bonding (Electronic packaging)
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Corrosion-induced failure analysis of Cu wire bonded packages
Wu, Yuelin
Text (2018)
Part of
Electronic Theses & Dissertations
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