MSU Libraries
Digital Repository
Home
About
Collections
Selected facets
Committee Member: Lai, Wei
×
Subject: Microelectronic packaging
×
Collection
Electronic Theses & Dissertations
1
Material Type
Theses
1
Language
English
1
Copyright Status
In Copyright
1
Subject
Copper wire
1
Copper--Corrosion
1
Electrolytic corrosion
1
Integrated circuits
1
Metals--Corrosion fatigue
1
Reliability
1
Research
1
Wire bonding (Electronic packaging)
1
Search results
Showing 1 to 1 of 1 results
Results per page
20
50
100
Sort by
Most Relevant
Title (A-Z)
Title (Z-A)
Date (Newest)
Date (Oldest)
Most Recent
Least Relevant
Corrosion-induced failure analysis of Cu wire bonded packages
Wu, Yuelin
Text (2018)
Part of
Electronic Theses & Dissertations
First
1
(current)
Last
