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Creator: Wu, Yuelin
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Subject: Microelectronic packaging
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Electronic Theses & Dissertations
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Material Type
Theses
1
Language
English
1
Copyright Status
In Copyright
1
Subject
Copper wire
1
Copper--Corrosion
1
Electrolytic corrosion
1
Integrated circuits
1
Metals--Corrosion fatigue
1
Reliability
1
Research
1
Wire bonding (Electronic packaging)
1
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Corrosion-induced failure analysis of Cu wire bonded packages
Wu, Yuelin
Text (2018)
Part of
Electronic Theses & Dissertations
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