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Electronic Theses & Dissertations
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Copper--Creep
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Joints (Engineering)--Testing
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Metals--Creep
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Metals--Fatigue--Testing
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Solder and soldering
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Solder and soldering--Testing
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Thermal stresses
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Influence of nano-structured chemicals on the microstructures and mechanical reliability of lead-free tin-based solders
Choudhuri, Deep
Text (2009)
Part of
Electronic Theses & Dissertations
Studies on lead-free solders reinforced with mechanically-incorporated Cu, Ag, and Ni particles
Guo, Fu
Text (2002)
Part of
Electronic Theses & Dissertations
Studies on in-situ particulate reinforced Sn-Ag composite solders relevant to thermomechanical fatigue issues
Choi, Sunglak
Text (2001)
Part of
Electronic Theses & Dissertations
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