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  • Subject: Solder and soldering
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  • Electronic Theses & Dissertations
    7
  • Theses
    7
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  • In Copyright
    7
  • Anisotropy
    1
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  • Lead-free electronics manufacturing processes
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    2
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    2
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  • Metals--Thermomechanical properties
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Showing 1 to 7 of 7 results
  • Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Darbandi, Payam
    Text (2014)
    Part of Electronic Theses & Dissertations
    In Copyright
  • Characterization of microstructural evolution of crept, aged, and thermomechanically fatigued eutectic Sn-Ag solder joints using orientation imaging microscopy

    Telang, Adwait U. (Adwait Uday)
    Text (2002)
    Part of Electronic Theses & Dissertations
    In Copyright
  • An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures

    McDougall, Jeffrey Lee
    Text (1998)
    Part of Electronic Theses & Dissertations
    In Copyright
  • Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints

    Zhou, Bite
    Text (2012)
    Part of Electronic Theses & Dissertations
    In Copyright
  • Stress relaxation in lead-free solder joints

    Jadhav, Susheel Ganeshrao
    Text (2001)
    Part of Electronic Theses & Dissertations
    In Copyright
  • Studies on lead-free solders reinforced with mechanically-incorporated Cu, Ag, and Ni particles

    Guo, Fu
    Text (2002)
    Part of Electronic Theses & Dissertations
    In Copyright
  • Studies on in-situ particulate reinforced Sn-Ag composite solders relevant to thermomechanical fatigue issues

    Choi, Sunglak
    Text (2001)
    Part of Electronic Theses & Dissertations
    In Copyright
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