Effect of coarsened microstructure on electromigration behavior of eutectic Pb-Sn solder joints

In Collections: Electronic Theses & Dissertations

Copyright Status: In Copyright

Material Type: Theses

Authors: Lee, Yi-Chih

Date Published: 2010

Subjects: Electrodiffusion
Lead-tin alloys
Solder and soldering

Program of Study: Materials Science and Engineering

Degree Level: Masters

Language: English

Pages: ix, 96 pages

ISBN: 9781124653686
1124653686

Permalink: https://doi.org/doi:10.25335/tss1-fn71

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