In recent years, researchers have been working to explore the millimeter-wave frequency domain for wireless technology to cope with the immense demand for high bandwidth for faster wireless applications such as communication and remote sensing in general. In wireless communication technology, high frequency of the mm-wave systems offers high bandwidth transmission for faster data transmission. The mm-wave frequency has also been approved by FCC for commercial applications like 5G communications that will deliver a more reliable, dependable and scalable cellular technology with high rate and low latency for the network users. It also promises to facilitate high data communication among devices and humans as well as other devices, the phenomena that gave rise to an emerging field known as the "Internet-of-Things". For remote sensing, higher frequencies of the mm-wave offer higher spatial and range resolution that can enable more intelligent sensor technologies.The fabrication and manufacturing process of mm-wave systems become increasingly difficult and expensive due to size reduction at smaller wavelengths. To overcome these problems, system on package (SoP) technology has gained a lot of attention. The SoP approach combines multiple integrated circuits and passive components using different packaging and interconnect approaches into a miniaturized micro-system module. Additive manufacturing (AM), also colloquially known as 3-D printing, is considered as a promising method for packaging in SoP solutions because it enables rapid prototyping and large-scale production at an affordable cost and minimal environmental impact.This work primarily focuses on the development of mm-wave microsystems by integrating chips with AM process using aerosol jet printing (AJP). Several mm-wave transceiver components that ranges from Ka-band to W-band are designed and realized in a state-of-the-art silicon-germanium IC foundry process, and are characterized to be used in complete transceiver system using 3-D printing packaging. These include a 28-60 GHz Single-Pole Double-Throw (SPDT) switch, 28-60 GHz Low-noise amplifier (LNA), 15-100 GHz downconverting mixer, K-Band upconverting mixer, V-band upconverting mixer, and a 90 GHz MMIC frequency tripler.The feasibility of using AJP in mm-wave regime and the ink characteristics were also studied. For any AM process to be an all-in-one packaging solution, it should have the capability of realizing conducting as well as dielectric materials. Silver and polyimide inks were used in this work to demonstrate a chip-to-chip interconnection and a comparison with the traditional packaging technique is also discussed. An ultra-wideband interconnect from 0.1-110 GHz was implemented using AJP. The conductivity of the silver ink and its viability to be used in flexible electronics was also considered.
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