IC packaging is a critical factor in emerging next generation RF and mmWave systems design. As demand for higher data bandwidth and greater device connectivity increases, methods for developing low cost and high quality RF systems in the mmWave range and beyond must be developed and improved upon. Many traditional manufacturing techniques have been iterated on to address this issue, but most run into a hard limit in terms of RF performance and the ability to miniaturize heterogeneously integrated architectures into cost effective packages.Additive manufacturing (AM) offers emerging processes that may be used to address these issues, providing solutions that are low operating cost and flexible to a wide range of design geometries. Some high performance designs that are difficult or unavailable with traditional manufacturing techniques may be realized using AM, extending the use of more robust IC packaging to high frequency applications.This dissertation presents engineering advancements in the field of RF and mmWave systems manufacturing through the use of AM techniques. Chip-in-Pocket (CiP) IC packaging is investigated, including the impact of printed die fill materials and interconnects on RF system performance at Ku-band. Printed die attach techniques and their effect on the reliability of printed interconnects and die leveling are explored. Finally, a processes for transferring printed RF components and packages from the printing substrate to other surfaces will be demonstrated for Ku to Ka-band components as a means to improve manufacturing reliability of systems leveraging AM components and demonstrate the efficacy of combining AM components with traditional manufacturing. Aerosol-Jet Printing (AJP) is leveraged as the main AM method for high precision RF structures including IC interconnects and vias, all the way up to full IC packages that may be applied to PCB pad layouts.
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