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Material Type: Theses
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Subject: Solder and soldering
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Subject: Thermal stresses
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Electronic Theses & Dissertations
2
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English
2
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Joints (Engineering)--Testing
1
Metals--Creep
2
Metals--Fatigue--Testing
1
Metals--Thermomechanical properties
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Thermal stresses
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An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures
McDougall, Jeffrey Lee
Text (1998)
Part of
Electronic Theses & Dissertations
Studies on in-situ particulate reinforced Sn-Ag composite solders relevant to thermomechanical fatigue issues
Choi, Sunglak
Text (2001)
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Electronic Theses & Dissertations
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