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Degree Level: Doctoral
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Subject: Solder and soldering
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Collection
Electronic Theses & Dissertations
7
Material Type
Theses
7
Language
English
7
Copyright Status
In Copyright
7
Subject
Anisotropy
1
Copper--Creep
1
Crystals
1
Deformations (Mechanics)
1
Dislocations in metals
2
Electronic packaging--Materials
1
Joints (Engineering)
1
Joints (Engineering)--Testing
1
Lead-free electronics manufacturing processes
1
Metallography
1
Metals--Creep
1
Metals--Fatigue
2
Metals--Fatigue--Testing
1
Metals--Thermomechanical properties
4
Nickel--Creep
1
Silver
1
Silver--Metallography
1
Thermal stresses
1
Tin
2
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Characterization of deformation in Sn-Ag lead-free solders during thermomechanical fatigue using orientation imaging microscopy
Telang, Adwait U. (Adwait Uday)
Text (2004)
Part of
Electronic Theses & Dissertations
Studies on in-situ particulate reinforced Sn-Ag composite solders relevant to thermomechanical fatigue issues
Choi, Sunglak
Text (2001)
Part of
Electronic Theses & Dissertations
Studies on lead-free solders reinforced with mechanically-incorporated Cu, Ag, and Ni particles
Guo, Fu
Text (2002)
Part of
Electronic Theses & Dissertations
Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint
Darbandi, Payam
Text (2014)
Part of
Electronic Theses & Dissertations
Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints
Zhou, Bite
Text (2012)
Part of
Electronic Theses & Dissertations
Investigation of thermomechanical fatique (TMF) behavior in tin-silver based solder joints
Lee, Jong-Gi
Text (2005)
Part of
Electronic Theses & Dissertations
Roles of service parameters on the mechanical behavior of lead-free solder joints
Rhee, Hongjoo
Text (2005)
Part of
Electronic Theses & Dissertations
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