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Characterization of microstructural evolution of crept, aged, and thermomechanically fatigued eutectic Sn-Ag solder joints using orientation imaging microscopy

Characterization of microstructural evolution of crept, aged, and thermomechanically fatigued eutectic Sn-Ag solder joints using orientation imaging microscopy

Telang, Adwait U. (Adwait Uday)

Text (2002)

Part of Electronic Theses & Dissertations

An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures

An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures

McDougall, Jeffrey Lee

Text (1998)

Part of Electronic Theses & Dissertations

An investigation of aging kinetics and creep deformation in composite solders with in-situ particulate reinforcements

An investigation of aging kinetics and creep deformation in composite solders with in-situ particulate reinforcements

Text (1997)

Part of Electronic Theses & Dissertations

Effect of coarsened microstructure on electromigration behavior of eutectic Pb-Sn solder joints

Effect of coarsened microstructure on electromigration behavior of eutectic Pb-Sn solder joints

Text (2010)

Part of Electronic Theses & Dissertations

Stress relaxation in lead-free solder joints

Stress relaxation in lead-free solder joints

Jadhav, Susheel Ganeshrao

Text (2001)

Part of Electronic Theses & Dissertations