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Degree Level: Masters
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Subject: Solder and soldering
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Electronic Theses & Dissertations
5
Material Type
Theses
5
Language
English
5
Copyright Status
In Copyright
5
Subject
Deformations (Mechanics)
1
Dislocations in metals
1
Electrodiffusion
1
Joints (Engineering)
1
Lead-tin alloys
1
Metallography
1
Metals--Creep
2
Silver
1
Stress relaxation (Physics)
1
Thermal stresses
1
Tin
1
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Characterization of microstructural evolution of crept, aged, and thermomechanically fatigued eutectic Sn-Ag solder joints using orientation imaging microscopy
Telang, Adwait U. (Adwait Uday)
Text (2002)
Part of
Electronic Theses & Dissertations
An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures
McDougall, Jeffrey Lee
Text (1998)
Part of
Electronic Theses & Dissertations
An investigation of aging kinetics and creep deformation in composite solders with in-situ particulate reinforcements
Choi, Sunglak
Text (1997)
Part of
Electronic Theses & Dissertations
Effect of coarsened microstructure on electromigration behavior of eutectic Pb-Sn solder joints
Lee, Yi-Chih
Text (2010)
Part of
Electronic Theses & Dissertations
Stress relaxation in lead-free solder joints
Jadhav, Susheel Ganeshrao
Text (2001)
Part of
Electronic Theses & Dissertations
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