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Subject: Solder and soldering
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Electronic Theses & Dissertations
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Theses
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Anisotropy
1
Copper--Creep
1
Crystals
1
Deformations (Mechanics)
2
Dislocations in metals
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Electrodiffusion
1
Electronic packaging--Materials
1
Joints (Engineering)
2
Joints (Engineering)--Testing
1
Lead-free electronics manufacturing processes
1
Lead-tin alloys
1
Metallography
2
Metals--Creep
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Metals--Fatigue
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Metals--Fatigue--Testing
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Metals--Thermomechanical properties
4
Nickel--Creep
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Silver
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Silver--Metallography
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Stress relaxation (Physics)
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Thermal stresses
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Tin
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Roles of service parameters on the mechanical behavior of lead-free solder joints
Rhee, Hongjoo
Text (2005)
Part of
Electronic Theses & Dissertations
Studies on in-situ particulate reinforced Sn-Ag composite solders relevant to thermomechanical fatigue issues
Choi, Sunglak
Text (2001)
Part of
Electronic Theses & Dissertations
Stress relaxation in lead-free solder joints
Jadhav, Susheel Ganeshrao
Text (2001)
Part of
Electronic Theses & Dissertations
Characterization of microstructural evolution of crept, aged, and thermomechanically fatigued eutectic Sn-Ag solder joints using orientation imaging microscopy
Telang, Adwait U. (Adwait Uday)
Text (2002)
Part of
Electronic Theses & Dissertations
Studies on lead-free solders reinforced with mechanically-incorporated Cu, Ag, and Ni particles
Guo, Fu
Text (2002)
Part of
Electronic Theses & Dissertations
Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint
Darbandi, Payam
Text (2014)
Part of
Electronic Theses & Dissertations
Investigation of thermomechanical fatique (TMF) behavior in tin-silver based solder joints
Lee, Jong-Gi
Text (2005)
Part of
Electronic Theses & Dissertations
An investigation of aging kinetics and creep deformation in composite solders with in-situ particulate reinforcements
Choi, Sunglak
Text (1997)
Part of
Electronic Theses & Dissertations
An analysis of global and localized creep strains and creep properties of non-composite and composite lead-free solders at room and elevated temperatures
McDougall, Jeffrey Lee
Text (1998)
Part of
Electronic Theses & Dissertations
Characterization of deformation in Sn-Ag lead-free solders during thermomechanical fatigue using orientation imaging microscopy
Telang, Adwait U. (Adwait Uday)
Text (2004)
Part of
Electronic Theses & Dissertations
Effect of coarsened microstructure on electromigration behavior of eutectic Pb-Sn solder joints
Lee, Yi-Chih
Text (2010)
Part of
Electronic Theses & Dissertations
Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints
Zhou, Bite
Text (2012)
Part of
Electronic Theses & Dissertations
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